HiSilicon Kirin 910 contre HiSilicon Kirin 910T. Spécifications, performances, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Série
  HiSilicon Kirin HiSilicon Kirin
• Génération
  1 1
• Groupe de CPU
  HiSilicon Kirin 910 HiSilicon Kirin 910

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Fréquence
  1.60 GHz 1.80 GHz
• Cœurs de CPU
  4 4
• Turbo (1 cœur)
  1.60 GHz 1.80 GHz
• Fils de processeur
  4 4
• Turbo (4 Cores)
  1.60 GHz 1.80 GHz
• Hyperthreading
  Non Non
• Overclocking
  Non Non
• Architecture de base
  normal normal

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nom du GPU
  ARM Mali-450 MP4 ARM Mali-450 MP4
• GPU frequency
  0.53 GHz 0.70 GHz
• GPU (Turbo)
  0.53 GHz 0.70 GHz
• Unités d'exécution
  4 4
• Shader
  64 64
• Max. displays
  1 1
• Génération
  Utgard Utgard
• Processus technologique
  28nm 28nm
• Date de sortie
  2012 2012

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Non Non
• h265 / HEVC (10 bit)
  Non Non
• h264
  Non Non
• VP9
  Non Non
• VP8
  Non Non
• AV1
  Non Non
• AVC
  Non Non
• VC-1
  Non Non
• JPEG
  Non Non

Overview of the types and quantities of RAM supported by HiSilicon Kirin 910T et HiSilicon Kirin 910. The supported memory frequencies may vary depending on the motherboard configuration.

• Type de mémoire
  LPDDR3 LPDDR3
• ECC
  Non Non
• Canaux de mémoire
  1 1

• AES-NI
  Non Non

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 910 et HiSilicon Kirin 910T to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 910 et HiSilicon Kirin 910T, including virtual machine technologies and fabrication processes.

• Jeu d'instructions (ISA)
  ARMv7-A32 (32 bit) ARMv7-A32 (32 bit)
• Virtualization
  None None
• Architecture
  Cortex-A9 Cortex-A9
• Processus technologique
  28 nm 28 nm
• Socket
  N/A N/A
• Date de sortie
  Q1/2014 Q1/2014