HiSilicon Kirin 659
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Libéré
Q2/2016
HiSilicon Kirin 659

Processeur HiSilicon Kirin 659, spécifications et caractéristiques de référence

1823 place dans le classement général des processeurs !
Le processeur HiSilicon Kirin 659 est installé sur des cartes avec un socket N/A et fonctionne à une fréquence de 1.70 GHz. Le HiSilicon Kirin 659 compte un total de 8 cœurs. Date de sortie : Q2/2016. Le TDP est de . Cet aperçu vous donnera toutes les spécifications techniques et des données détaillées sur le processeur HiSilicon Kirin 659. Découvrez tout pour savoir si un jeu ou un logiciel fonctionnera sur le HiSilicon Kirin 659.

Spécifications

Données techniques
CPU Family and Group

This section provides a comprehensive overview of the processors generation and family, explaining the specific market segment it is designed for. It covers key details such as the CPUs position within its product lineup, its intended use cases (e.g., consumer, server, or workstation), and how its generation compares to previous models.

  • Segment
    Mobile
  • Série
  • Génération
    4
  • Groupe de CPU
    HiSilicon Kirin 650
  • Modèle précédent
    --
  • Successor
    --
CPU Technical Specs

HiSilicon Kirin 659. This section highlights key performance parameters of the processor, including the number of cores, threads, and clock speeds (base and boost frequencies). These metrics directly impact multitasking capabilities and overall system performance in both single-threaded and multi-threaded applications.

  • Fréquence
    1.70 GHz
  • Cœurs de CPU
    8
  • Turbo (1 cœur)
    2.36 GHz
  • Fils de processeur
    8
  • Turbo (8 Cores)
    2.36 GHz
  • Hyperthreading
    Non
  • Overclocking
    Non
  • Architecture de base
    hybrid (big.LITTLE)
  • A core
    4x Cortex-A53
  • B core
    4x Cortex-A53
  • C core
    --
IGPU

This section provides details on the integrated graphics capabilities of the processor. It covers the architecture, performance characteristics, and supported technologies (e.g., DirectX, OpenGL), which are essential for systems without dedicated GPUs or for mobile devices that require energy-efficient graphics processing.

  • Nom du GPU
    ARM Mali-T830 MP2
  • GPU frequency
    0.90 GHz
  • GPU (Turbo)
    0.90 GHz
  • Unités d'exécution
    2
  • Shader
    32
  • Max. GPU Memory
    --
  • Max. displays
    2
  • Génération
    Midgard 4
  • DirectX Version
    11
  • Processus technologique
    28nm
  • Date de sortie
    Q4/2015
Prise en charge des codecs matériels

This section covers the built-in hardware codec support for video and image processing. The processor’s ability to handle codecs like H.264, HEVC, and VP9 directly influences its performance in tasks such as video playback, editing, and streaming. This hardware acceleration ensures smoother media handling with lower CPU utilization.

  • h265 / HEVC (8 bit)
    Decode / Encode
  • h265 / HEVC (10 bit)
    Decode
  • h264
    Decode / Encode
  • VP9
    Non
  • VP8
    Decode / Encode
  • AV1
    Non
  • AVC
    Non
  • VC-1
    Non
  • JPEG
    Decode / Encode
Memory Specs & PCI

This section breaks down the technical characteristics of the memory supported by the processor, including the types (e.g., DDR4, DDR5), number of memory channels, and maximum supported memory speed. It also covers PCI Express support, which determines the bandwidth available for GPUs, SSDs, and other peripherals, critical for high-performance systems.

  • Type de mémoire
    LPDDR3-933
  • Max. Mémoire
  • ECC
    Non
  • Canaux de mémoire
    2
  • Version PCIe
  • Couloirs PCIe
Cryptage

This section focuses on the hardware-based security technologies integrated into the processor. These include encryption support features such as AES-NI, Intel SGX, and AMD Secure Memory Encryption, which provide robust protection for sensitive data and help mitigate cybersecurity risks.

  • AES-NI
    Non
Consommation d'énergie
  • TDP (PL1)
  • TDP up
    --
  • TDP (PL2)
    --
  • TDP down
    --
  • Température maximale
    --
* voir ci-dessous
Technologies and Extensions

This section explains the underlying technologies that enable the processor to deliver high performance. It includes details about the manufacturing process (e.g., 7nm, 10nm), supported instruction sets (e.g., AVX, SSE), and virtual machine extensions that enhance compatibility and efficiency across various workloads.

  • Jeu d'instructions (ISA)
    ARMv8-A64 (64 bit)
  • Virtualization
    None
  • Extensions ISA
  • L2-Cache
    --
  • L3-Cache
    --
  • Architecture
    Cortex-A53 / Cortex-A53
  • Processus technologique
    16 nm
  • Socket
    N/A
  • Date de sortie
    Q2/2016
  • Part Number
    --
Positions dans tous les classements

Positions communes HiSilicon Kirin 659 CPU dans des benchmarks populaires, pour comparaison avec d'autres modèles.

  • Geekbench 5, 64bit (Single-Core)
    1428 place
  • Geekbench 5, 64bit (Multi-Core)
    1350 place
  • iGPU - FP32 Performance (Single-precision GFLOPS)
    1721 place

Benchmarks

Tests de performance CPU

Compare the benchmark scores of HiSilicon Kirin 659 with other processors to gauge its real-world performance across various tasks..

These tests encompass tasks such as mathematical calculations, 3D rendering, cryptocurrency mining, and performance evaluations in both single-core and multi-core modes.

Geekbench 5, 64bit (Single-Core)
Geekbench 5 SC is a popular cross-platform performance test for desktop or mobile processors that uses system memory intensively
198
197
189
188
HiSilicon Kirin 659
Geekbench 5, 64bit (Multi-Core)
Geekbench 5 MC is a popular cross-platform performance test for desktop or mobile processors that uses system memory intensively
871
866
863
855
HiSilicon Kirin 659
iGPU - FP32 Performance (Single-precision GFLOPS)
Les performances de l'iGPU - le GPU interne dans les jeux.
41
41
41
41
HiSilicon Kirin 659

Synonymes

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HiSilicon Kirin 650 Voir
AMD E1 Micro-6200T Voir
MediaTek MT8735 Voir
AMD Sempron 2650 Voir
Samsung Exynos 7884 Voir
Intel Atom x6212RE Voir

*

PL1 - The power limit (in watts) generated by the processor (or GPU) during sustained, standard operation. It represents the typical thermal output during normal workloads.

PL2 - Represents the maximum power limit under heavy load or overclocking conditions. It indicates the thermal output during peak performance.

These values are essential for determining the optimal cooling system and power supply required to maintain stable performance.

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HiSilicon Kirin 659

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