Processeur HiSilicon Kirin 655, spécifications et caractéristiques de référence

This section provides a comprehensive overview of the processors generation and family, explaining the specific market segment it is designed for. It covers key details such as the CPUs position within its product lineup, its intended use cases (e.g., consumer, server, or workstation), and how its generation compares to previous models.

• Segment
  Mobile
• Série
  HiSilicon Kirin
• Génération
  4
• Groupe de CPU
  HiSilicon Kirin 650
• Modèle précédent
  --
• Successor
  --

HiSilicon Kirin 655. This section highlights key performance parameters of the processor, including the number of cores, threads, and clock speeds (base and boost frequencies). These metrics directly impact multitasking capabilities and overall system performance in both single-threaded and multi-threaded applications.

• Fréquence
  1.70 GHz
• Cœurs de CPU
  8
• Turbo (1 cœur)
  2.12 GHz
• Fils de processeur
  8
• Turbo (8 Cores)
  2.12 GHz
• Hyperthreading
  Non
• Overclocking
  Non
• Architecture de base
  hybrid (big.LITTLE)
• A core
  4x Cortex-A53
• B core
  4x Cortex-A53
• C core
  --

This section provides details on the integrated graphics capabilities of the processor. It covers the architecture, performance characteristics, and supported technologies (e.g., DirectX, OpenGL), which are essential for systems without dedicated GPUs or for mobile devices that require energy-efficient graphics processing.

• Nom du GPU
  ARM Mali-T830 MP2
• GPU frequency
  0.90 GHz
• GPU (Turbo)
  0.90 GHz
• Unités d'exécution
  2
• Shader
  32
• Max. GPU Memory
  --
• Max. displays
  2
• Génération
  Midgard 4
• DirectX Version
  11
• Processus technologique
  28nm
• Date de sortie
  Q4/2015

This section covers the built-in hardware codec support for video and image processing. The processor’s ability to handle codecs like H.264, HEVC, and VP9 directly influences its performance in tasks such as video playback, editing, and streaming. This hardware acceleration ensures smoother media handling with lower CPU utilization.

• h265 / HEVC (8 bit)
  Decode / Encode
• h265 / HEVC (10 bit)
  Decode
• h264
  Decode / Encode
• VP9
  Non
• VP8
  Decode / Encode
• AV1
  Non
• AVC
  Non
• VC-1
  Non
• JPEG
  Decode / Encode

This section breaks down the technical characteristics of the memory supported by the processor, including the types (e.g., DDR4, DDR5), number of memory channels, and maximum supported memory speed. It also covers PCI Express support, which determines the bandwidth available for GPUs, SSDs, and other peripherals, critical for high-performance systems.

• Type de mémoire
  LPDDR3-933
• Max. Mémoire
• ECC
  Non
• Canaux de mémoire
  2
• Version PCIe
• Couloirs PCIe

This section focuses on the hardware-based security technologies integrated into the processor. These include encryption support features such as AES-NI, Intel SGX, and AMD Secure Memory Encryption, which provide robust protection for sensitive data and help mitigate cybersecurity risks.

• AES-NI
  Non

• TDP (PL1)
• TDP up
  --
• TDP (PL2)
  --
• TDP down
  --
• Température maximale
  --

This section explains the underlying technologies that enable the processor to deliver high performance. It includes details about the manufacturing process (e.g., 7nm, 10nm), supported instruction sets (e.g., AVX, SSE), and virtual machine extensions that enhance compatibility and efficiency across various workloads.

• Jeu d'instructions (ISA)
  ARMv8-A64 (64 bit)
• Virtualization
  None
• Extensions ISA
• L2-Cache
  --
• L3-Cache
  --
• Architecture
  Cortex-A53 / Cortex-A53
• Processus technologique
  16 nm
• Socket
  N/A
• Date de sortie
  Q2/2016
• Part Number
  --

Positions communes HiSilicon Kirin 655 CPU dans des benchmarks populaires, pour comparaison avec d'autres modèles.

• Geekbench 5, 64bit (Single-Core)
  1442 place
• Geekbench 5, 64bit (Multi-Core)
  1384 place
• iGPU - FP32 Performance (Single-precision GFLOPS)
  1718 place