Qualcomm Snapdragon 810 contre Qualcomm Snapdragon 810 v2. Spécifications, performances, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Série
  Qualcomm Snapdragon Qualcomm Snapdragon
• Groupe de CPU
  Qualcomm Snapdragon 808/810 Qualcomm Snapdragon 808/810
• Segment
  Mobile Mobile
• Génération
  2 2

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  8 / 8 8 / 8
• Architecture de base
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A-Core
  4x Cortex-A57 4x Cortex-A57
• B-Core
  4x Cortex-A53 4x Cortex-A53
• Fréquence
  1.50 GHz 1.50 GHz
• Turbo (1 cœur)
  2.00 GHz 2.00 GHz
• Turbo (8 Cores)
  2.00 GHz 2.00 GHz
• Hyperthreading
  Non Non
• Overclocking
  Non Non

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nom du GPU
  Qualcomm Adreno 430 Qualcomm Adreno 430
• GPU frequency
  0.60 GHz 0.63 GHz
• GPU (Turbo)
  0.60 GHz 0.63 GHz
• Shader
  256 256
• Génération
  4 4
• Direct X
  11 11
• Processus technologique
  20 nm 20 nm
• Date de sortie
  Q2/2014 Q2/2014

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode
• h265 / HEVC (10 bit)
  Non Non
• h264
  Decode / Encode Decode / Encode
• VP8
  Non Non
• VP9
  Non Non
• AV1
  Non Non
• AVC
  Non Non
• VC-1
  Decode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 810 v2 et Qualcomm Snapdragon 810. The supported memory frequencies may vary depending on the motherboard configuration.

• Type de mémoire
  LPDDR4-1600 LPDDR4-1600
• Canaux de mémoire
  2 2
• ECC
  Non Non
• AES-NI
  Non Non

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 810 et Qualcomm Snapdragon 810 v2 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 810 et Qualcomm Snapdragon 810 v2, including virtual machine technologies and fabrication processes.

• Jeu d'instructions (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Architecture
  Cortex-A57 / Cortex-A53 Cortex-A57 / Cortex-A53
• Processus technologique
  20 nm 20 nm
• Virtualization
  None None
• Socket
  N/A N/A
• Date de sortie
  Q3/2014 2015
• Part Number
  MSM8994 MSM8994v2