HiSilicon Kirin 650 contre Qualcomm Snapdragon 808. Spécifications, performances, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Série
  HiSilicon Kirin Qualcomm Snapdragon
• Génération
  4 2
• Groupe de CPU
  HiSilicon Kirin 650 Qualcomm Snapdragon 808/810

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Fréquence
  1.70 GHz 1.44 GHz
• Turbo (1 cœur)
  2.00 GHz 1.82 GHz
• Hyperthreading
  Non Non
• Overclocking
  Non Non
• Architecture de base
  hybrid (big.LITTLE) hybrid (big.LITTLE)

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nom du GPU
  ARM Mali-T830 MP2 Qualcomm Adreno 418
• GPU frequency
  0.90 GHz 0.60 GHz
• GPU (Turbo)
  0.90 GHz 0.60 GHz
• Unités d'exécution
  2 Geekbench 5 SC is a popular cross-platform performance test for desktnt la mémoire du système.
• Shader
  32 128
• Max. displays
  2 Geekbench 5 SC is a popular cross-platform performance test for desktnt la mémoire du système.
• Génération
  Midgard 4 4
• Processus technologique
  28nm 20 nm
• Date de sortie
  Q4/2015 Q2/2014

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode Non
• h264
  Decode / Encode Decode / Encode
• VP9
  Non Non
• VP8
  Decode / Encode Non
• AV1
  Non Non
• AVC
  Non Non
• VC-1
  Non Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 808 et HiSilicon Kirin 650. The supported memory frequencies may vary depending on the motherboard configuration.

• Type de mémoire
  LPDDR3-933 LPDDR3-933
• ECC
  Non Non
• Canaux de mémoire
  2 2

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 650 et Qualcomm Snapdragon 808 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 650 et Qualcomm Snapdragon 808, including virtual machine technologies and fabrication processes.

• Jeu d'instructions (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualization
  None None
• Architecture
  Cortex-A53 / Cortex-A53 Cortex-A57 / Cortex-A53
• Processus technologique
  16 nm 20 nm
• Socket
  N/A N/A
• Date de sortie
  Q2/2016 Q3/2014
• Part Number
  -- MSM8992