AMD EPYC 9354P contre AMD Ryzen Embedded V3C48. Spécifications, performances, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Série
  AMD EPYC AMD Ryzen Embedded V
• Groupe de CPU
  AMD EPYC 9004 AMD Ryzen Embedded V3000
• Segment
  Desktop / Server Desktop / Server
• Génération
  4 3
• Modèle précédent
  -- AMD Ryzen Embedded V2748

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  32 / 64 8 / 16
• Architecture de base
  normal normal
• Cœurs
  32x Zen 4 8x Zen 3
• Hyperthreading / SMT
  Oui Oui
• Overclocking
  Non Non
• Fréquence
  3.25 GHz 3.30 GHz
• Turbo Frequency (1 Core)
  3.80 GHz 3.80 GHz

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nom du GPU
  pas d'iGPU pas d'iGPU
• GPU (Turbo)
  Pas de turbo Pas de turbo

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Non Non
• h265 / HEVC (10 bit)
  Non Non
• h264
  Non Non
• VP8
  Non Non
• VP9
  Non Non
• AV1
  Non Non
• AVC
  Non Non
• VC-1
  Non Non
• JPEG
  Non Non

Overview of the types and quantities of RAM supported by AMD Ryzen Embedded V3C48 et AMD EPYC 9354P. The supported memory frequencies may vary depending on the motherboard configuration.

• Type de mémoire
  DDR5-4800 DDR5-4800
• Max. Mémoire
  6144 GB 64 GB
• Canaux de mémoire
  12 2 (Dual Channel)
• Bandwidth
  461.0 GB/s 76.8 GB/s
• ECC
  Oui Oui
• PCIe
  5.0 x 128 4.0 x 20
• AES-NI
  Oui Oui

Analyze the TDP (Thermal Design Power) requirements of AMD EPYC 9354P et AMD Ryzen Embedded V3C48 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP up
  300 W 54 W
• TDP down
  240 W 35 W
• Température maximale
  100 °C 105 °C

Information on architecture, interfaces, and additional instructions supported by AMD EPYC 9354P et AMD Ryzen Embedded V3C48, including virtual machine technologies and fabrication processes.

• Processus technologique
  5 nm 6 nm
• Chip design
  Chiplet Chiplet
• Socket
  SP5 FP7r2
• L2-Cache
  32.00 MB 4.00 MB
• L3-Cache
  256.00 MB 16.00 MB
• Architecture
  Genoa / Genoa-X (Zen 4) Rembrandt (Zen 3+)
• Operating systems
  Windows Server 2022, Linux, Windows 11 Windows 10, Windows 11, Linux
• Virtualization
  AMD-V, SVM AMD-V, SVM
• Jeu d'instructions (ISA)
  x86-64 (64 bit) x86-64 (64 bit)
• Extensions ISA
  SSE4.2, AVX2, AVX-512, BFLOAT16, VNNI SSE4a, SSE4.1, SSE4.2, AVX2, FMA3
• Date de sortie
  Q4/2022 Q3/2022
• Release price
  2730 $ --
• Part Number
  100-000000805 --
• spécification
  Technical data sheet Technical data sheet