UNISOC T606 contra Qualcomm Snapdragon 410 LTE. Especificaciones, rendimiento, pruebas

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Serie
  UNISOC 4G Qualcomm Snapdragon
• Grupo CPU
  UNISOC 4G 12nm Qualcomm Snapdragon 410
• Segmento
  Mobile Mobile
• Generación
  0 2

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  8 / 8 4 / 4
• Arquitectura del núcleo
  hybrid (big.LITTLE) normal
• A-Core
  2x Cortex-A75 --
• B-Core
  6x Cortex-A55 --
• Overclocking
  No No

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nombre de la GPU
  ARM Mali-G57 MP1 Qualcomm Adreno 306
• GPU frequency
  0.65 GHz 0.40 GHz
• GPU (Turbo)
  sin turbo 0.40 GHz
• Unidades de ejecución
  2 0
• Shader
  32 24
• Max. GPU Memory
  4 GB --
• Max. displays
  2 0
• Generación
  Vallhall 1 3
• Direct X
  12 11
• Proceso técnico
  7 nm 28 nm
• Fecha de publicación
  Q2/2020 Q3/2012

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode / Encode No
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode No
• VP9
  Decode / Encode No
• AV1
  Decode No
• AVC
  Decode / Encode No
• VC-1
  Decode / Encode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 410 LTE y UNISOC T606. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo de memoria
  LPDDR4X-1600 LPDDR2-533LPDDR3-533
• Canales de memoria
  0 1
• ECC
  No No
• AES-NI
  No No

Analyze the TDP (Thermal Design Power) requirements of UNISOC T606 y Qualcomm Snapdragon 410 LTE to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by UNISOC T606 y Qualcomm Snapdragon 410 LTE, including virtual machine technologies and fabrication processes.

• Proceso técnico
  12 nm 28 nm
• Enchufe
  -- N/A
• Arquitectura
  Cortex-A53
• Virtualización
  None None
• Juego de instrucciones (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Fecha de publicación
  Q3/2021 2014
• Part Number
  -- MSM8916