UNISOC T606 gegen Qualcomm Snapdragon 410 LTE. Spezifikationen, Leistung, Tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Serie
  UNISOC 4G Qualcomm Snapdragon
• CPU Gruppe
  UNISOC 4G 12nm Qualcomm Snapdragon 410
• Segment
  Mobile Mobile
• Generation
  0 2

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  8 / 8 4 / 4
• Zentrale Architektur
  hybrid (big.LITTLE) normal
• A-Core
  2x Cortex-A75 --
• B-Core
  6x Cortex-A55 --
• Übertaktung
  Nein Nein

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU-Name
  ARM Mali-G57 MP1 Qualcomm Adreno 306
• GPU frequency
  0.65 GHz 0.40 GHz
• GPU (Turbo)
  kein Turbo 0.40 GHz
• Ausführungseinheiten
  2 0
• Shader
  32 24
• Max. GPU Memory
  4 GB --
• Max. displays
  2 0
• Generation
  Vallhall 1 3
• Direct X
  12 11
• technisches verfahren
  7 nm 28 nm
• Datum der Veröffentlichung
  Q2/2020 Q3/2012

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode / Encode Nein
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Nein
• VP9
  Decode / Encode Nein
• AV1
  Decode Nein
• AVC
  Decode / Encode Nein
• VC-1
  Decode / Encode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 410 LTE und UNISOC T606. The supported memory frequencies may vary depending on the motherboard configuration.

• Speicher Typ
  LPDDR4X-1600 LPDDR2-533LPDDR3-533
• Speicherkanäle
  0 1
• ECC
  Nein Nein
• AES-NI
  Nein Nein

Analyze the TDP (Thermal Design Power) requirements of UNISOC T606 und Qualcomm Snapdragon 410 LTE to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by UNISOC T606 und Qualcomm Snapdragon 410 LTE, including virtual machine technologies and fabrication processes.

• technisches verfahren
  12 nm 28 nm
• Steckdose
  -- N/A
• Architektur
  Cortex-A53
• Virtualisierung
  None None
• Befehlssatz (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Datum der Veröffentlichung
  Q3/2021 2014
• Part Number
  -- MSM8916