Qualcomm Snapdragon 8cx contra HiSilicon Kirin 990 4G. Especificaciones, rendimiento, pruebas

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Serie
  Qualcomm Snapdragon HiSilicon Kirin
• Grupo CPU
  Qualcomm Snapdragon 8cx HiSilicon Kirin 990
• Segmento
  Mobile Mobile
• Generación
  3 8

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Arquitectura del núcleo
  hybrid (big.LITTLE) hybrid (Prime / big.LITTLE)
• Frecuencia
  1.80 GHz 1.86 GHz
• Turbo (1 núcleo)
  2.84 GHz 2.09 GHz
• Turbo (8 Cores)
  2.84 GHz 2.86 GHz
• Hyperthreading
  No No
• Overclocking
  No No

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nombre de la GPU
  Qualcomm Adreno 680 ARM Mali-G76 MP16
• GPU frequency
  0.25 GHz 0.60 GHz
• GPU (Turbo)
  0.59 GHz sin turbo
• Unidades de ejecución
  8 16
• Shader
  768 256
• Max. GPU Memory
  4 GB 4 GB
• Max. displays
  2 2
• Generación
  5 Bifrost 3
• Proceso técnico
  7 nm 7 nm
• Fecha de publicación
  Q4/2018 Q3/2018

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode Decode / Encode
• AV1
  No No
• AVC
  Decode Decode / Encode
• VC-1
  Decode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 990 4G y Qualcomm Snapdragon 8cx. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo de memoria
  LPDDR4X-2133 LPDDR4X-2133
• Max. Memoria
  16 GB 8 GB
• Canales de memoria
  8 4
• ECC
  No No

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 8cx y HiSilicon Kirin 990 4G to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  7 W 6 W

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 8cx y HiSilicon Kirin 990 4G, including virtual machine technologies and fabrication processes.

• Juego de instrucciones (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L3-Cache
  2.00 MB 2.00 MB
• Arquitectura
  Kryo 495 Cortex-A76 / Cortex-A55
• Proceso técnico
  7 nm 7 nm
• Virtualización
  None None
• Enchufe
  N/A N/A
• Fecha de publicación
  Q4/2018 Q3/2019