Qualcomm Snapdragon 8cx vs HiSilicon Kirin 990 4G. Specifications, performance, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Family
  Qualcomm Snapdragon HiSilicon Kirin
• CPU group
  Qualcomm Snapdragon 8cx HiSilicon Kirin 990
• Segment
  Mobile Mobile
• Generation
  3 8

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Core architecture
  hybrid (big.LITTLE) hybrid (Prime / big.LITTLE)
• Frequency
  1.80 GHz 1.86 GHz
• Turbo (1 Core)
  2.84 GHz 2.09 GHz
• Turbo (8 Cores)
  2.84 GHz 2.86 GHz
• Hyperthreading
  No No
• Overclocking
  No No

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU name
  Qualcomm Adreno 680 ARM Mali-G76 MP16
• GPU frequency
  0.25 GHz 0.60 GHz
• GPU (Turbo)
  0.59 GHz No turbo
• Execution units
  8 16
• Shader
  768 256
• Max. GPU Memory
  4 GB 4 GB
• Max. displays
  2 2
• Generation
  5 Bifrost 3
• Technology
  7 nm 7 nm
• Release date
  Q4/2018 Q3/2018

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode Decode / Encode
• AV1
  No No
• AVC
  Decode Decode / Encode
• VC-1
  Decode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 990 4G and Qualcomm Snapdragon 8cx. The supported memory frequencies may vary depending on the motherboard configuration.

• Memory type
  LPDDR4X-2133 LPDDR4X-2133
• Max. Memory
  16 GB 8 GB
• Memory channels
  8 4
• ECC
  No No

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 8cx and HiSilicon Kirin 990 4G to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  7 W 6 W

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 8cx and HiSilicon Kirin 990 4G, including virtual machine technologies and fabrication processes.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L3-Cache
  2.00 MB 2.00 MB
• Architecture
  Kryo 495 Cortex-A76 / Cortex-A55
• Technology
  7 nm 7 nm
• Virtualization
  None None
• Socket
  N/A N/A
• Release date
  Q4/2018 Q3/2019