HiSilicon Kirin 910T contra Intel Atom E3805. Especificaciones, rendimiento, pruebas

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segmento
  Mobile Mobile
• Serie
  HiSilicon Kirin Intel Atom
• Generación
  1 4
• Grupo CPU
  HiSilicon Kirin 910 Intel Atom E3800

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frecuencia
  1.80 GHz 1.33 GHz
• Núcleos de CPU
  4 2
• Turbo (1 núcleo)
  1.80 GHz sin turbo
• Hilos de la CPU
  4 2
• Hyperthreading
  No No
• Overclocking
  No No
• Arquitectura del núcleo
  normal normal

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nombre de la GPU
  ARM Mali-450 MP4 sin iGPU
• GPU frequency
  0.70 GHz
• GPU (Turbo)
  0.70 GHz sin turbo
• Unidades de ejecución
  4
• Shader
  64
• Max. displays
  1
• Generación
  Utgard
• Proceso técnico
  28nm
• Fecha de publicación
  2012

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  No No
• h265 / HEVC (10 bit)
  No No
• h264
  No No
• VP9
  No No
• VP8
  No No
• AV1
  No No
• AVC
  No No
• VC-1
  No No
• JPEG
  No No

Overview of the types and quantities of RAM supported by Intel Atom E3805 y HiSilicon Kirin 910T. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo de memoria
  LPDDR3 DDR3L-1066 SO-DIMM
• Max. Memoria
  8 GB
• ECC
  No Sí
• Canales de memoria
  1 1
• Versión PCIe
  2.0
• Carriles PCIe
  4

• AES-NI
  No Sí

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 910T y Intel Atom E3805 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  3 W
• Temperatura máxima
  -- 110 °C

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 910T y Intel Atom E3805, including virtual machine technologies and fabrication processes.

• Juego de instrucciones (ISA)
  ARMv7-A32 (32 bit) x86-64 (64 bit)
• Virtualización
  None VT-x, VT-x EPT
• Extensiones ISA
  SSE4.1, SSE4.2
• L3-Cache
  -- 1.00 MB
• Arquitectura
  Cortex-A9 Bay Trail
• Proceso técnico
  28 nm 22 nm
• Enchufe
  N/A BGA 1170
• Fecha de publicación
  Q1/2014 Q4/2014