HiSilicon Kirin 910T gegen Intel Atom E3805. Spezifikationen, Leistung, Tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Serie
  HiSilicon Kirin Intel Atom
• Generation
  1 4
• CPU Gruppe
  HiSilicon Kirin 910 Intel Atom E3800

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frequenz
  1.80 GHz 1.33 GHz
• CPU Kerne
  4 2
• Turbo (1 Kern)
  1.80 GHz kein Turbo
• CPU Threads
  4 2
• Hyperthreading
  Nein Nein
• Übertaktung
  Nein Nein
• Zentrale Architektur
  normal normal

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU-Name
  ARM Mali-450 MP4 keine iGPU
• GPU frequency
  0.70 GHz
• GPU (Turbo)
  0.70 GHz kein Turbo
• Ausführungseinheiten
  4
• Shader
  64
• Max. displays
  1
• Generation
  Utgard
• technisches verfahren
  28nm
• Datum der Veröffentlichung
  2012

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Nein Nein
• h265 / HEVC (10 bit)
  Nein Nein
• h264
  Nein Nein
• VP9
  Nein Nein
• VP8
  Nein Nein
• AV1
  Nein Nein
• AVC
  Nein Nein
• VC-1
  Nein Nein
• JPEG
  Nein Nein

Overview of the types and quantities of RAM supported by Intel Atom E3805 und HiSilicon Kirin 910T. The supported memory frequencies may vary depending on the motherboard configuration.

• Speicher Typ
  LPDDR3 DDR3L-1066 SO-DIMM
• Max. Speicher
  8 GB
• ECC
  Nein Ja
• Speicherkanäle
  1 1
• PCIe-Version
  2.0
• PCIe-Lanes
  4

• AES-NI
  Nein Ja

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 910T und Intel Atom E3805 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  3 W
• Maximale Temperatur
  -- 110 °C

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 910T und Intel Atom E3805, including virtual machine technologies and fabrication processes.

• Befehlssatz (ISA)
  ARMv7-A32 (32 bit) x86-64 (64 bit)
• Virtualisierung
  None VT-x, VT-x EPT
• ISA-Erweiterungen
  SSE4.1, SSE4.2
• L3-Cache
  -- 1.00 MB
• Architektur
  Cortex-A9 Bay Trail
• technisches verfahren
  28 nm 22 nm
• Steckdose
  N/A BGA 1170
• Datum der Veröffentlichung
  Q1/2014 Q4/2014