MediaTek Helio G96 vs Qualcomm Snapdragon 690. Specifications, performance, tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Family
  Mediatek Helio Qualcomm Snapdragon
• Generation
  1 8
• CPU group
  MediaTek Helio G90 Qualcomm Snapdragon 690

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Frequency
  2.00 GHz 1.70 GHz
• CPU Cores
  8 8
• Turbo (1 Core)
  2.05 GHz 2.00 GHz
• CPU Threads
  8 8
• Turbo (8 Cores)
  2.00 GHz 1.70 GHz
• Hyperthreading
  No No
• Overclocking
  No No
• Core architecture
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A core
  2x Cortex-A76 2x Kryo 560 Gold
• B core
  6x Cortex-A55 6x Kryo 560 Silver

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU name
  ARM Mali-G57 MP2 Qualcomm Adreno 619L
• GPU frequency
  0.90 GHz 0.95 GHz
• GPU (Turbo)
  No turbo No turbo
• Execution units
  2 0
• Shader
  32 0
• Max. GPU Memory
  4 GB --
• Max. displays
  2 0
• Generation
  Vallhall 1 6
• DirectX Version
  12 12.1
• Technology
  7 nm 8 nm
• Release date
  Q2/2020 Q4/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode / Encode Decode
• h264
  Decode / Encode Decode
• VP9
  Decode / Encode Decode
• VP8
  Decode / Encode Decode
• AV1
  Decode No
• AVC
  Decode / Encode Decode
• VC-1
  Decode / Encode Decode
• JPEG
  Decode / Encode Decode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 690 and MediaTek Helio G96. The supported memory frequencies may vary depending on the motherboard configuration.

• Memory type
  LPDDR4X-2133 LPDDR4X-1866
• Max. Memory
  10 GB
• ECC
  No No
• Memory channels
  2 2
• PCIe version
  --
• PCIe lanes
  --

• AES-NI
  No No

Analyze the TDP (Thermal Design Power) requirements of MediaTek Helio G96 and Qualcomm Snapdragon 690 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  --

Information on architecture, interfaces, and additional instructions supported by MediaTek Helio G96 and Qualcomm Snapdragon 690, including virtual machine technologies and fabrication processes.

• Instruction set (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualization
  None None
• ISA extensions
  --
• Architecture
  Cortex-A76 / Cortex-A55 Kryo 560
• Technology
  12 nm 8 nm
• Socket
  N/A N/A
• Release date
  Q3/2021 Q4/2020
• Part Number
  -- SM6350