MediaTek Helio X30 gegen Qualcomm Snapdragon 730G. Spezifikationen, Leistung, Tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Serie
  Mediatek Helio Qualcomm Snapdragon
• CPU Gruppe
  MediaTek Helio X30 Qualcomm Snapdragon 730
• Segment
  Mobile Mobile
• Generation
  3 2

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  10 / 10 8 / 8
• Zentrale Architektur
  hybrid (Prime / big.LITTLE) hybrid (big.LITTLE)
• A-Core
  2x Cortex-A73 2x Kryo 470 Gold
• B-Core
  4x Cortex-A53 6x Kryo 470 Silver
• C-Core
  4x Cortex-A35 --
• Übertaktung
  Nein Nein

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU-Name
  PowerVR 7XTP-MT4 (GT7400 Plus) Qualcomm Adreno 618
• GPU frequency
  0.85 GHz 0.83 GHz
• GPU (Turbo)
  0.85 GHz kein Turbo
• Ausführungseinheiten
  8 0
• Shader
  32 128
• Max. GPU Memory
  -- 4 GB
• Max. displays
  1 2
• Generation
  6
• Direct X
  12 12.1
• technisches verfahren
  10 14 nm
• Datum der Veröffentlichung
  Q1/2016 Q2/2019

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Nein Decode
• h265 / HEVC (10 bit)
  Nein Decode
• h264
  Nein Decode / Encode
• VP8
  Nein Decode
• VP9
  Nein Decode
• AV1
  Nein Nein
• AVC
  Nein Decode
• VC-1
  Nein Decode
• JPEG
  Nein Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 730G und MediaTek Helio X30. The supported memory frequencies may vary depending on the motherboard configuration.

• Speicher Typ
  LPDDR4X-1866 LPDDR4X-1866
• Max. Speicher
  8 GB 8 GB
• Speicherkanäle
  2 2
• ECC
  Nein Nein
• AES-NI
  Nein Nein

Analyze the TDP (Thermal Design Power) requirements of MediaTek Helio X30 und Qualcomm Snapdragon 730G to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by MediaTek Helio X30 und Qualcomm Snapdragon 730G, including virtual machine technologies and fabrication processes.

• Befehlssatz (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Architektur
  Cortex-A73 / -A53 / -A35 Kryo 470 Gold/475 Silver
• technisches verfahren
  10 nm 8 nm
• Virtualisierung
  None None
• Steckdose
  N/A N/A
• Datum der Veröffentlichung
  Q2/2017 Q2/2019
• Part Number
  MT6799 SM7150-AB