Qualcomm Snapdragon 690 5G gegen MediaTek Helio X30. Spezifikationen, Leistung, Tests

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Serie
  Qualcomm Snapdragon Mediatek Helio
• CPU Gruppe
  Qualcomm Snapdragon 690 MediaTek Helio X30
• Segment
  Mobile Mobile
• Generation
  8 3
• Successor
  Qualcomm Snapdragon 695 5G --

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  8 / 8 10 / 10
• Zentrale Architektur
  hybrid (big.LITTLE) hybrid (Prime / big.LITTLE)
• A-Core
  2x Kryo 560 Gold 2x Cortex-A73
• B-Core
  6x Kryo 560 Silver 4x Cortex-A53
• Hyperthreading / SMT
  Nein Nein
• Übertaktung
  Nein Nein
• A-Core Frequency
  2.00 GHz 1.90 GHz (2.60 GHz)
• B-Core Frequency
  1.70 GHz --

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU-Name
  Qualcomm Adreno 619L PowerVR 7XTP-MT4 (GT7400 Plus)
• GPU frequency
  0.95 GHz 0.85 GHz
• GPU (Turbo)
  kein Turbo 0.85 GHz
• Ausführungseinheiten
  0 8
• Shader
  0 32
• Max. displays
  0 1
• Generation
  6
• Direct X
  12.1 12
• technisches verfahren
  8 nm 10
• Datum der Veröffentlichung
  Q4/2020 Q1/2016

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Nein
• h265 / HEVC (10 bit)
  Decode Nein
• h264
  Decode Nein
• VP8
  Decode Nein
• VP9
  Decode Nein
• AV1
  Nein Nein
• AVC
  Decode Nein
• VC-1
  Decode Nein
• JPEG
  Decode Nein

Overview of the types and quantities of RAM supported by MediaTek Helio X30 und Qualcomm Snapdragon 690 5G. The supported memory frequencies may vary depending on the motherboard configuration.

• Speicher Typ
  LPDDR4X-1866 LPDDR4X-1866
• Max. Speicher
  8 GB
• Speicherkanäle
  2 2
• ECC
  Nein Nein
• AES-NI
  Nein Nein

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 690 5G und MediaTek Helio X30 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 690 5G und MediaTek Helio X30, including virtual machine technologies and fabrication processes.

• Befehlssatz (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Architektur
  Kryo 560 Cortex-A73 / -A53 / -A35
• technisches verfahren
  8 nm 10 nm
• Virtualisierung
  None None
• Steckdose
  N/A N/A
• Datum der Veröffentlichung
  Q4/2020 Q2/2017
• Part Number
  SM6350 MT6799
• Operating systems
  Android Android