HiSilicon Kirin 9000E
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选择视频卡1
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总分
star star star star star
已发布
Q4/2020
HiSilicon Kirin 9000E

处理器 HiSilicon Kirin 9000E, 规格和基准

550 在总排名中CPU的位置!
HiSilicon Kirin 9000E 处理器安装在 N/A 插槽的主板上,工作频率为 2.04 GHz。HiSilicon Kirin 9000E 共有 8 个核心。发布日期:Q4/2020。TDP 为 。此评测将提供 HiSilicon Kirin 9000E 处理器的所有技术规格和详细数据。了解一切,以确定游戏或软件是否可以在 HiSilicon Kirin 9000E 上运行。

规格

技术数据
CPU Family and Group

This section provides a comprehensive overview of the processors generation and family, explaining the specific market segment it is designed for. It covers key details such as the CPUs position within its product lineup, its intended use cases (e.g., consumer, server, or workstation), and how its generation compares to previous models.

  • 分段
    Mobile
  • 系列
  • 一代人
    9
  • CPU组
    HiSilicon Kirin 9000
  • 过去的模式
    --
  • Successor
    --
CPU Technical Specs

HiSilicon Kirin 9000E. This section highlights key performance parameters of the processor, including the number of cores, threads, and clock speeds (base and boost frequencies). These metrics directly impact multitasking capabilities and overall system performance in both single-threaded and multi-threaded applications.

  • 頻率
    2.04 GHz
  • CPU核数
    8
  • 涡轮增压 (1核)
    3.13 GHz
  • CPU线程
    8
  • Turbo (8 Cores)
    2.54 GHz
  • 超线程
    没有
  • 超频
    没有
  • 核心架构
    hybrid (Prime / big.LITTLE)
  • A core
    1x Cortex-A77
  • B core
    3x Cortex-A77
  • C core
    4x Cortex-A55
IGPU

This section provides details on the integrated graphics capabilities of the processor. It covers the architecture, performance characteristics, and supported technologies (e.g., DirectX, OpenGL), which are essential for systems without dedicated GPUs or for mobile devices that require energy-efficient graphics processing.

  • GPU名称
    ARM Mali-G78 MP22
  • GPU frequency
    0.76 GHz
  • GPU (Turbo)
    没有涡轮增压
  • 执行单位
    22
  • 着色器
    352
  • Max. GPU Memory
    --
  • Max. displays
    1
  • 一代人
    Vallhall 2
  • DirectX Version
    12
  • 技术过程
    5 nm
  • 发布日期
    Q4/2020
硬件编解码器支持

This section covers the built-in hardware codec support for video and image processing. The processor’s ability to handle codecs like H.264, HEVC, and VP9 directly influences its performance in tasks such as video playback, editing, and streaming. This hardware acceleration ensures smoother media handling with lower CPU utilization.

  • h265 / HEVC (8 bit)
    Decode / Encode
  • h265 / HEVC (10 bit)
    Decode / Encode
  • h264
    Decode / Encode
  • VP9
    Decode / Encode
  • VP8
    Decode / Encode
  • AV1
    Decode
  • AVC
    Decode / Encode
  • VC-1
    Decode / Encode
  • JPEG
    Decode / Encode
Memory Specs & PCI

This section breaks down the technical characteristics of the memory supported by the processor, including the types (e.g., DDR4, DDR5), number of memory channels, and maximum supported memory speed. It also covers PCI Express support, which determines the bandwidth available for GPUs, SSDs, and other peripherals, critical for high-performance systems.

  • 存储器类型
    LPDDR4X-2133LPDDR5-2750
  • 最大内存
  • ECC
    没有
  • 记忆通道
    4
  • PCIe版本
  • PCIe通道
加密

This section focuses on the hardware-based security technologies integrated into the processor. These include encryption support features such as AES-NI, Intel SGX, and AMD Secure Memory Encryption, which provide robust protection for sensitive data and help mitigate cybersecurity risks.

  • AES-NI
    没有
能源消耗
  • TDP (PL1)
  • TDP up
    --
  • TDP (PL2)
    --
  • TDP down
    --
  • 最高温度
    --
* 见下文
Technologies and Extensions

This section explains the underlying technologies that enable the processor to deliver high performance. It includes details about the manufacturing process (e.g., 7nm, 10nm), supported instruction sets (e.g., AVX, SSE), and virtual machine extensions that enhance compatibility and efficiency across various workloads.

  • 指令集(ISA)
    ARMv8-A64 (64 bit)
  • 虚拟化
    None
  • ISA扩展
  • L2-Cache
    --
  • L2-Cache
    --
  • 建筑学
    Cortex-A77 / Cortex-A55
  • 技术过程
    5 nm
  • 插座
    N/A
  • 发布日期
    Q4/2020
  • Part Number
    --
所有排名中的位置

共同立场 HiSilicon Kirin 9000E 在流行的基准测试中的CPU,用于与其他型号进行比较.

  • Geekbench 5, 64bit (Single-Core)
    483 place
  • Geekbench 5, 64bit (Multi-Core)
    646 place
  • iGPU - FP32 Performance (Single-precision GFLOPS)
    89 place
  • AnTuTu 8 benchmark
    10 place

基准

性能测试 CPU

Compare the benchmark scores of HiSilicon Kirin 9000E with other processors to gauge its real-world performance across various tasks..

These tests encompass tasks such as mathematical calculations, 3D rendering, cryptocurrency mining, and performance evaluations in both single-core and multi-core modes.

Geekbench 5, 64bit (Single-Core)
Geekbench 5 SC是一个流行的跨平台性能测试,适用于密集使用系统内存的桌面或移动处理器。
1067
1066
1066
1063
HiSilicon Kirin 9000E
Geekbench 5, 64bit (Multi-Core)
Geekbench 5 MC是一个流行的跨平台性能测试,适用于密集使用系统内存的桌面或移动处理器。
3781
3779
3770
3767
HiSilicon Kirin 9000E
iGPU - FP32 Performance (Single-precision GFLOPS)
iGPU的性能--游戏中的内部GPU
2150
2150
2147
2137
HiSilicon Kirin 9000E
AnTuTu 8 benchmark
AnTuTu 8基准测试通过模拟Android、iOS、AI、SoC的浏览器和应用程序性能来测试ARM处理器。
651364
647817
634870
632768
HiSilicon Kirin 9000E

同义词

在性能方面,类似的处理器。

在技术数据处理人员中与之相似的是 HiSilicon Kirin 9000E.

Intel Xeon E-2246G 查看
Intel Xeon E3-1270 v5 查看
Intel Xeon E5-2695 v3 查看
Apple A12X Bionic 查看
Intel Xeon E-2276G 查看
Intel Xeon E3-1230 v6 查看
Intel Core i7-6700 查看
Apple A15 Bionic 查看

*

PL1 - The power limit (in watts) generated by the processor (or GPU) during sustained, standard operation. It represents the typical thermal output during normal workloads.

PL2 - Represents the maximum power limit under heavy load or overclocking conditions. It indicates the thermal output during peak performance.

These values are essential for determining the optimal cooling system and power supply required to maintain stable performance.

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HiSilicon Kirin 9000E

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