UNISOC T760 对 Qualcomm Snapdragon 7c Gen 2. 规格、性能、测试

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 系列
  UNISOC 5G Qualcomm Snapdragon
• CPU组
  UNISOC 5G 6nm Qualcomm Snapdragon 7c
• 分段
  Mobile Mobile
• 一代人
  0 2
• 过去的模式
  -- Qualcomm Snapdragon 7c

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  8 / 8 8 / 8
• 核心架构
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A-Core
  4x Cortex-A76 2x Kryo 468 Gold
• B-Core
  4x Cortex-A55 6x Kryo 468 Silver
• 超频
  没有 没有

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名称
  ARM Mali-G57 MP4 Qualcomm Adreno 618
• GPU frequency
  0.65 GHz 0.70 GHz
• GPU (Turbo)
  没有涡轮增压 没有涡轮增压
• 执行单位
  4 0
• 着色器
  64 128
• Max. GPU Memory
  4 GB 4 GB
• Max. displays
  2 2
• 一代人
  Vallhall 1 6
• Direct X
  12 12.1
• 技术过程
  7 nm 14 nm
• 发布日期
  Q2/2020 Q2/2019

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode / Encode Decode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode
• VP9
  Decode / Encode Decode
• AV1
  Decode 没有
• AVC
  Decode / Encode Decode
• VC-1
  Decode / Encode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 7c Gen 2 和 UNISOC T760. The supported memory frequencies may vary depending on the motherboard configuration.

• 存储器类型
  LPDDR4X-2133 LPDDR4X-2133
• 记忆通道
  2 (Dual Channel) 2
• ECC
  没有 没有
• AES-NI
  没有 没有

Analyze the TDP (Thermal Design Power) requirements of UNISOC T760 和 Qualcomm Snapdragon 7c Gen 2 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by UNISOC T760 和 Qualcomm Snapdragon 7c Gen 2, including virtual machine technologies and fabrication processes.

• 技术过程
  6 nm 8 nm
• 插座
  -- N/A
• 建筑学
  Kryo 468
• 虚拟化
  None None
• 指令集（ISA）
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• 发布日期
  Q2/2021 Q2/2021
• Part Number
  -- SC7180P