Qualcomm Snapdragon Microsoft SQ1 对 HiSilicon Kirin 980. 规格、性能、测试

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 系列
  Qualcomm Snapdragon HiSilicon Kirin
• CPU组
  Qualcomm Snapdragon SQ1/SQ2 HiSilicon Kirin 980
• 分段
  Mobile Mobile
• 一代人
  1 7

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• 核心架构
  hybrid (big.LITTLE) hybrid (Prime / big.LITTLE)
• 頻率
  1.80 GHz 1.80 GHz
• 涡轮增压 (1核)
  3.00 GHz 1.90 GHz
• Turbo (8 Cores)
  3.00 GHz 2.60 GHz
• 超线程
  没有 没有
• 超频
  没有 没有

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名称
  Qualcomm Adreno 685 ARM Mali-G76 MP10
• GPU frequency
  0.25 GHz 0.72 GHz
• GPU (Turbo)
  0.65 GHz 没有涡轮增压
• 执行单位
  8 10
• 着色器
  1536 160
• Max. GPU Memory
  4 GB 4 GB
• Max. displays
  2 2
• 一代人
  5 Bifrost 3
• 技术过程
  7 nm 7 nm
• 发布日期
  Q4/2018 Q3/2018

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode Decode / Encode
• AV1
  没有 没有
• AVC
  Decode Decode / Encode
• VC-1
  Decode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 980 和 Qualcomm Snapdragon Microsoft SQ1. The supported memory frequencies may vary depending on the motherboard configuration.

• 存储器类型
  LPDDR4X-2133 LPDDR4X-2133
• 最大内存
  16 GB 8 GB
• 记忆通道
  1 4
• ECC
  没有 没有

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon Microsoft SQ1 和 HiSilicon Kirin 980 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  7 W 6 W

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon Microsoft SQ1 和 HiSilicon Kirin 980, including virtual machine technologies and fabrication processes.

• 指令集（ISA）
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L2-Cache
  2.00 MB 2.00 MB
• 建筑学
  Kryo 495 Cortex-A76 / Cortex-A55
• 技术过程
  7 nm 7 nm
• 虚拟化
  None None
• 插座
  N/A N/A
• 发布日期
  Q3/2019 Q4/2018