Qualcomm Snapdragon 8 Gen 1 对 Qualcomm Snapdragon 865 Plus. 规格、性能、测试

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 系列
  Qualcomm Snapdragon Qualcomm Snapdragon
• CPU组
  Qualcomm Snapdragon 8 Gen 1 Qualcomm Snapdragon 865/870
• 分段
  Mobile Mobile
• 一代人
  1 7
• 过去的模式
  Qualcomm Snapdragon 888 --

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  8 / 8 8 / 8
• 核心架构
  hybrid (Prime / big.LITTLE) hybrid (Prime / big.LITTLE)
• A-Core
  1x Cortex-X2 1x Kryo 585 Prime
• B-Core
  3x Cortex-A710 3x Kryo 585 Gold
• C-Core
  4x Cortex-A510 4x Kryo 585 Silver
• 超频
  没有 没有

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名称
  Qualcomm Adreno 730 Qualcomm Adreno 650
• GPU frequency
  0.84 GHz 0.25 GHz
• GPU (Turbo)
  没有涡轮增压 0.67 GHz
• 执行单位
  0 2
• 着色器
  0 512
• Max. displays
  0 1
• 一代人
  7 6
• Direct X
  12.1 12.0
• 技术过程
  4 nm 7 nm
• 发布日期
  Q1/2022 Q4/2019

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• AV1
  没有 没有
• AVC
  Decode Decode
• VC-1
  Decode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 865 Plus 和 Qualcomm Snapdragon 8 Gen 1. The supported memory frequencies may vary depending on the motherboard configuration.

• 存储器类型
  LPDDR5-3200 LPDDR4X-4266LPDDR5-5500
• 最大内存
  16 GB 16 GB
• 记忆通道
  4 4
• ECC
  没有 没有
• AES-NI
  没有 没有

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 8 Gen 1 和 Qualcomm Snapdragon 865 Plus to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  10 W

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 8 Gen 1 和 Qualcomm Snapdragon 865 Plus, including virtual machine technologies and fabrication processes.

• 指令集（ISA）
  ARMv9-A64 (64 bit) ARMv8-A64 (64 bit)
• L2-Cache
  2.00 MB 2.00 MB
• L2-Cache
  4.00 MB 3.00 MB
• 建筑学
  Kryo Kryo 585
• 技术过程
  4 nm 7 nm
• 虚拟化
  None None
• 插座
  N/A N/A
• 发布日期
  Q1/2022 Q3/2020
• Part Number
  SM8450 SM8250-AB