Qualcomm Snapdragon 855 Plus 对 Intel Core i5-1130G7. 规格、性能、测试

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 系列
  Qualcomm Snapdragon Intel Core i5
• CPU组
  Qualcomm Snapdragon 855/860 Intel Core i 1100G/11000U
• 分段
  Mobile Mobile
• 一代人
  6 11
• Successor
  Qualcomm Snapdragon 860 --

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• 核心架构
  hybrid (Prime / big.LITTLE) normal
• 超频
  没有 没有

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名称
  Qualcomm Adreno 640 Intel Iris Xe Graphics 80 (Tiger Lake G7)
• GPU frequency
  0.25 GHz 0.40 GHz
• GPU (Turbo)
  0.68 GHz 1.10 GHz
• 执行单位
  4 80
• 着色器
  384 640
• Max. GPU Memory
  4 GB 16 GB
• Max. displays
  1 4
• 一代人
  5 12
• 技术过程
  7 nm 10 nm
• 发布日期
  Q1/2019 Q3/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode
• VP9
  Decode / Encode Decode / Encode
• AV1
  没有 Decode
• AVC
  没有 Decode / Encode
• VC-1
  没有 Decode
• JPEG
  没有 Decode / Encode

Overview of the types and quantities of RAM supported by Intel Core i5-1130G7 和 Qualcomm Snapdragon 855 Plus. The supported memory frequencies may vary depending on the motherboard configuration.

• 存储器类型
  LPDDR4X-4266 LPDDR4X-4266
• 最大内存
  16 GB 32 GB
• 记忆通道
  4 2
• ECC
  没有 没有

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 855 Plus 和 Intel Core i5-1130G7 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  15 W
• TDP down
  -- 7 W
• 最高温度
  -- 100 °C

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 855 Plus 和 Intel Core i5-1130G7, including virtual machine technologies and fabrication processes.

• 指令集（ISA）
  ARMv8-A64 (64 bit) x86-64 (64 bit)
• ISA扩展
  SSE4.1, SSE4.2, AVX2, AVX-512
• L2-Cache
  2.00 MB --
• L2-Cache
  3.00 MB 8.00 MB
• 建筑学
  Kryo 485 Tiger Lake U
• 技术过程
  7 nm 10 nm
• 虚拟化
  None VT-x, VT-x EPT, VT-d
• 插座
  N/A BGA 1526
• 发布日期
  Q4/2018 Q3/2020
• Part Number
  SM8150-AC --