Qualcomm Snapdragon 778G Plus 对 Qualcomm Snapdragon 8 Gen 1. 规格、性能、测试

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 系列
  Qualcomm Snapdragon Qualcomm Snapdragon
• CPU组
  Qualcomm Snapdragon 778 Qualcomm Snapdragon 8 Gen 1
• 分段
  Mobile Mobile
• 一代人
  4 1
• 过去的模式
  -- Qualcomm Snapdragon 888

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  8 / 8 8 / 8
• 核心架构
  hybrid (Prime / big.LITTLE) hybrid (Prime / big.LITTLE)
• A-Core
  1x Kryo 670 Prime 1x Cortex-X2
• B-Core
  3x Kryo 670 Gold 3x Cortex-A710
• C-Core
  4x Kryo 670 Silver 4x Cortex-A510
• 超频
  没有 没有

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名称
  Qualcomm Adreno 642L Qualcomm Adreno 730
• GPU frequency
  0.84 GHz
• GPU (Turbo)
  没有涡轮增压 没有涡轮增压
• 执行单位
  4 0
• 着色器
  384 0
• Max. GPU Memory
  4 GB --
• Max. displays
  1 0
• 一代人
  5 7
• Direct X
  12.0 12.1
• 技术过程
  6 nm 4 nm
• 发布日期
  Q2/2021 Q1/2022

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• AV1
  没有 没有
• AVC
  Decode Decode
• VC-1
  Decode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 8 Gen 1 和 Qualcomm Snapdragon 778G Plus. The supported memory frequencies may vary depending on the motherboard configuration.

• 存储器类型
  LPDDR5-3200 LPDDR5-3200
• 最大内存
  16 GB 16 GB
• 记忆通道
  2 4
• ECC
  没有 没有
• AES-NI
  没有 没有

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 778G Plus 和 Qualcomm Snapdragon 8 Gen 1 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 778G Plus 和 Qualcomm Snapdragon 8 Gen 1, including virtual machine technologies and fabrication processes.

• 指令集（ISA）
  ARMv8-A64 (64 bit) ARMv9-A64 (64 bit)
• L2-Cache
  -- 2.00 MB
• L2-Cache
  2.00 MB 4.00 MB
• 建筑学
  Kryo 670 Kryo
• 技术过程
  6 nm 4 nm
• 虚拟化
  None None
• 插座
  N/A N/A
• 发布日期
  Q4/2021 Q1/2022
• Part Number
  SM7325-AE SM8450