Qualcomm Snapdragon 765G 对 Qualcomm Snapdragon 768G. 规格、性能、测试

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 系列
  Qualcomm Snapdragon Qualcomm Snapdragon
• CPU组
  Qualcomm Snapdragon 760 Qualcomm Snapdragon 760
• 分段
  Mobile Mobile
• 一代人
  3 3

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  8 / 8 8 / 8
• 核心架构
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A-Core
  1x Kryo 475 Prime 1x Kryo 475 Prime
• B-Core
  1x Kryo 475 Gold 1x Kryo 475 Gold
• C-Core
  6x Kryo 475 Silver 6x Kryo 475 Silver
• 頻率
  1.80 GHz 1.80 GHz
• 涡轮增压 (1核)
  2.40 GHz 2.80 GHz
• Turbo (8 Cores)
  2.20 GHz 2.20 GHz
• 超线程
  没有 没有
• 超频
  没有 没有

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名称
  Qualcomm Adreno 620 Qualcomm Adreno 620
• GPU frequency
  0.75 GHz 0.80 GHz
• GPU (Turbo)
  没有涡轮增压 没有涡轮增压
• 着色器
  192 192
• Max. GPU Memory
  4 GB 4 GB
• Max. displays
  2 2
• 一代人
  6 6
• Direct X
  12.1 12.1
• 技术过程
  7 nm 7 nm
• 发布日期
  Q2/2019 Q2/2019

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode
• h265 / HEVC (10 bit)
  Decode Decode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode Decode
• VP9
  Decode Decode
• AV1
  没有 没有
• AVC
  Decode Decode
• VC-1
  Decode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 768G 和 Qualcomm Snapdragon 765G. The supported memory frequencies may vary depending on the motherboard configuration.

• 存储器类型
  LPDDR4-3733 LPDDR4-3733
• 最大内存
  8 GB 8 GB
• 记忆通道
  2 2
• ECC
  没有 没有
• AES-NI
  没有 没有

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 765G 和 Qualcomm Snapdragon 768G to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  5 W 5 W

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 765G 和 Qualcomm Snapdragon 768G, including virtual machine technologies and fabrication processes.

• 指令集（ISA）
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L2-Cache
  2.00 MB 2.00 MB
• 建筑学
  Kryo 475 Kryo 475
• 技术过程
  7 nm 7 nm
• 虚拟化
  None None
• 插座
  N/A N/A
• 发布日期
  Q3/2020 Q3/2020
• Part Number
  SM7250-AB SM7250-AC