Qualcomm Snapdragon 765 对 Intel Core i5-1030NG7. 规格、性能、测试

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 系列
  Qualcomm Snapdragon Intel Core i5
• CPU组
  Qualcomm Snapdragon 760 Intel Core i 1000G/10000U
• 分段
  Mobile Mobile
• 一代人
  3 10

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• 核心架构
  hybrid (big.LITTLE) normal
• 頻率
  1.80 GHz 1.10 GHz
• 涡轮增压 (1核)
  2.30 GHz 3.50 GHz
• 超线程
  没有 是
• 超频
  没有 没有

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名称
  Qualcomm Adreno 620 Intel Iris Plus Graphics (Ice Lake G7)
• GPU frequency
  0.63 GHz 0.30 GHz
• GPU (Turbo)
  没有涡轮增压 1.05 GHz
• 执行单位
  0 64
• 着色器
  192 512
• Max. GPU Memory
  4 GB --
• Max. displays
  2 3
• 一代人
  6 11
• 技术过程
  7 nm 14 nm
• 发布日期
  Q2/2019 Q3/2019

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode / Encode
• h265 / HEVC (10 bit)
  Decode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode Decode / Encode
• VP9
  Decode Decode / Encode
• AV1
  没有 没有
• AVC
  Decode Decode / Encode
• VC-1
  Decode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Intel Core i5-1030NG7 和 Qualcomm Snapdragon 765. The supported memory frequencies may vary depending on the motherboard configuration.

• 存储器类型
  LPDDR4-3733 LPDDR4-3733
• 最大内存
  8 GB 32 GB
• 记忆通道
  2 2
• ECC
  没有 没有

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 765 和 Intel Core i5-1030NG7 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  5 W 10 W
• 最高温度
  -- 100 °C

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 765 和 Intel Core i5-1030NG7, including virtual machine technologies and fabrication processes.

• 指令集（ISA）
  ARMv8-A64 (64 bit) x86-64 (64 bit)
• ISA扩展
  SSE4.1, SSE4.2, AVX2
• L2-Cache
  2.00 MB 6.00 MB
• 建筑学
  Kryo 475 Ice Lake U
• 技术过程
  7 nm 10 nm
• 虚拟化
  None VT-x, VT-x EPT, VT-d
• 插座
  N/A BGA 1526
• 发布日期
  Q3/2020 Q2/2020
• Part Number
  SM7250-AA --