Qualcomm Snapdragon 710 对 MediaTek Dimensity 1000C. 规格、性能、测试

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 系列
  Qualcomm Snapdragon Mediatek Dimensity
• CPU组
  Qualcomm Snapdragon 710 MediaTek Dimensity 1000
• 分段
  Mobile Mobile
• 一代人
  1 1

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• 核心架构
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• 頻率
  1.70 GHz 2.00 GHz
• 涡轮增压 (1核)
  2.20 GHz 2.00 GHz
• Turbo (8 Cores)
  2.20 GHz 2.00 GHz
• 超线程
  没有 没有
• 超频
  没有 没有

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名称
  Qualcomm Adreno 616 ARM Mali-G57 MP5
• GPU frequency
  0.75 GHz 0.95 GHz
• GPU (Turbo)
  0.75 GHz 没有涡轮增压
• 执行单位
  0 5
• 着色器
  256 80
• Max. GPU Memory
  -- 4 GB
• Max. displays
  0 2
• 一代人
  6 Vallhall 1
• 技术过程
  10 nm 7 nm
• 发布日期
  Q2/2018 Q2/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode / Encode
• h265 / HEVC (10 bit)
  Decode Decode / Encode
• h264
  Decode Decode / Encode
• VP8
  Decode Decode / Encode
• VP9
  Decode Decode / Encode
• AV1
  没有 Decode
• AVC
  Decode Decode / Encode
• VC-1
  Decode Decode / Encode
• JPEG
  Decode Decode / Encode

Overview of the types and quantities of RAM supported by MediaTek Dimensity 1000C 和 Qualcomm Snapdragon 710. The supported memory frequencies may vary depending on the motherboard configuration.

• 存储器类型
  LPDDR4X-1866 LPDDR4X-1866
• 最大内存
  8 GB 12 GB
• 记忆通道
  2 4
• ECC
  没有 没有

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 710 和 MediaTek Dimensity 1000C to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 710 和 MediaTek Dimensity 1000C, including virtual machine technologies and fabrication processes.

• 指令集（ISA）
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• 建筑学
  Kryo 360 Cortex-A77 / Cortex-A55
• 技术过程
  10 nm 7 nm
• 虚拟化
  None None
• 插座
  N/A N/A
• 发布日期
  Q2/2018 Q3/2020
• Part Number
  -- MT6883Z/CZA