MediaTek Helio G90T 对 Qualcomm Snapdragon 7c. 规格、性能、测试

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 分段
  Mobile Mobile
• 系列
  Mediatek Helio Qualcomm Snapdragon
• 一代人
  1 2
• CPU组
  MediaTek Helio G90 Qualcomm Snapdragon 7c
• Successor
  -- Qualcomm Snapdragon 7c Gen 2

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• 頻率
  2.00 GHz 2.40 GHz
• 涡轮增压 (1核)
  2.05 GHz 2.40 GHz
• Turbo (8 Cores)
  2.00 GHz 2.40 GHz
• 超线程
  没有 没有
• 超频
  没有 没有
• 核心架构
  hybrid (big.LITTLE) hybrid (big.LITTLE)

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名称
  ARM Mali-G76 MP4 Qualcomm Adreno 618
• GPU frequency
  0.80 GHz 0.70 GHz
• GPU (Turbo)
  没有涡轮增压 没有涡轮增压
• 执行单位
  4 0
• 着色器
  64 128
• Max. GPU Memory
  4 GB 4 GB
• Max. displays
  2 2
• 一代人
  Bifrost 3 6
• 技术过程
  7 nm 14 nm
• 发布日期
  Q3/2018 Q2/2019

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode / Encode Decode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode
• VP8
  Decode / Encode Decode
• AV1
  没有 没有
• AVC
  Decode / Encode Decode
• VC-1
  Decode / Encode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 7c 和 MediaTek Helio G90T. The supported memory frequencies may vary depending on the motherboard configuration.

• 存储器类型
  LPDDR4X-2133 LPDDR4X-2133
• 最大内存
  10 GB
• ECC
  没有 没有
• 记忆通道
  2 2

Analyze the TDP (Thermal Design Power) requirements of MediaTek Helio G90T 和 Qualcomm Snapdragon 7c to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  --

Information on architecture, interfaces, and additional instructions supported by MediaTek Helio G90T 和 Qualcomm Snapdragon 7c, including virtual machine technologies and fabrication processes.

• 指令集（ISA）
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• 虚拟化
  None None
• ISA扩展
  --
• 建筑学
  Cortex-A76 / Cortex-A55 Kryo 468
• 技术过程
  12 nm 8 nm
• 插座
  N/A N/A
• 发布日期
  Q3/2019 2020
• Part Number
  MT6785V/CC SC7180