MediaTek Helio A22 对 Qualcomm Snapdragon 680 4G. 规格、性能、测试

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 系列
  Mediatek Helio Qualcomm Snapdragon
• CPU组
  MediaTek Helio A22 Qualcomm Snapdragon 680
• 分段
  Mobile Mobile
• 一代人
  1 6

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  4 / 4 8 / 8
• 核心架构
  normal hybrid (big.LITTLE)
• Hyperthreading / SMT
  没有 没有
• 超频
  没有 没有

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名称
  PowerVR GE8300 Qualcomm Adreno 610
• GPU frequency
  0.65 GHz
• GPU (Turbo)
  没有涡轮增压 没有涡轮增压
• 执行单位
  1 0
• 着色器
  0 128
• Max. GPU Memory
  -- 4 GB
• Max. displays
  1 0
• 一代人
  6
• Direct X
  10 12.1
• 技术过程
  20 nm 11 nm
• 发布日期
  Q1/2017 Q2/2019

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  没有 Decode
• h265 / HEVC (10 bit)
  没有 Decode
• h264
  没有 Decode / Encode
• VP8
  没有 Decode
• VP9
  没有 Decode
• AV1
  没有 没有
• AVC
  没有 Decode
• VC-1
  没有 Decode
• JPEG
  没有 Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 680 4G 和 MediaTek Helio A22. The supported memory frequencies may vary depending on the motherboard configuration.

• 存储器类型
  LPDDR4X-3200 LPDDR4X-2133
• 最大内存
  3 GB 4 GB
• 记忆通道
  1 2
• Bandwidth
  -- 17.0 GB/s
• ECC
  没有 没有
• AES-NI
  没有 没有

Analyze the TDP (Thermal Design Power) requirements of MediaTek Helio A22 和 Qualcomm Snapdragon 680 4G to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by MediaTek Helio A22 和 Qualcomm Snapdragon 680 4G, including virtual machine technologies and fabrication processes.

• 指令集（ISA）
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• 建筑学
  Cortex-A53 / Cortex-A53 Kryo 265
• 技术过程
  16 nm 6 nm
• 虚拟化
  None None
• 插座
  N/A N/A
• 发布日期
  Q2/2020 Q1/2022
• Part Number
  -- SM6225
• Operating systems
  Android Android