MediaTek Dimensity 9200 对 HiSilicon Kirin 990 5G. 规格、性能、测试

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 系列
  Mediatek Dimensity HiSilicon Kirin
• CPU组
  MediaTek Dimensity 9200 HiSilicon Kirin 990
• 分段
  Mobile Mobile
• 一代人
  4 8
• 过去的模式
  MediaTek Dimensity 9000+ --

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• 核心架构
  hybrid (Prime / big.LITTLE) hybrid (Prime / big.LITTLE)
• 超频
  没有 没有

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名称
  ARM Immortalis-G715 MP11 ARM Mali-G76 MP16
• GPU frequency
  0.90 GHz 0.60 GHz
• GPU (Turbo)
  没有涡轮增压 没有涡轮增压
• 执行单位
  11 16
• 着色器
  -- 256
• Max. GPU Memory
  -- 4 GB
• Max. displays
  -- 2
• 一代人
  Vallhall Bifrost 3
• 技术过程
  4 nm 7 nm
• 发布日期
  Q4/2022 Q3/2018

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• AV1
  Decode 没有
• AVC
  Decode / Encode Decode / Encode
• VC-1
  Decode / Encode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 990 5G 和 MediaTek Dimensity 9200. The supported memory frequencies may vary depending on the motherboard configuration.

• 存储器类型
  LPDDR5X-8533 LPDDR4X-4266
• 最大内存
  -- 8 GB
• 记忆通道
  4 (Quad Channel) 4
• ECC
  没有 没有

Analyze the TDP (Thermal Design Power) requirements of MediaTek Dimensity 9200 和 HiSilicon Kirin 990 5G to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  -- 6 W

Information on architecture, interfaces, and additional instructions supported by MediaTek Dimensity 9200 和 HiSilicon Kirin 990 5G, including virtual machine technologies and fabrication processes.

• 技术过程
  4 nm 7 nm
• 插座
  N/A N/A
• L2-Cache
  -- 2.00 MB
• 建筑学
  Cortex-X3 / -A715 / -A510 Cortex-A76 / Cortex-A55
• 虚拟化
  None None
• 指令集（ISA）
  ARMv9-A64 (64 bit) ARMv8-A64 (64 bit)
• ISA扩展
  --
• 发布日期
  Q4/2022 Q3/2019