MediaTek Dimensity 6020 对 HiSilicon Kirin 990 4G. 规格、性能、测试

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 系列
  Mediatek Dimensity HiSilicon Kirin
• CPU组
  MediaTek Dimensity 6000 HiSilicon Kirin 990
• 分段
  Mobile Mobile
• 一代人
  0 8

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• 核心架构
  hybrid (big.LITTLE) hybrid (Prime / big.LITTLE)
• 超频
  没有 没有

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名称
  ARM Mali-G57 MP2 ARM Mali-G76 MP16
• GPU frequency
  0.01 GHz 0.60 GHz
• GPU (Turbo)
  没有涡轮增压 没有涡轮增压
• 执行单位
  2 16
• 着色器
  32 256
• Max. GPU Memory
  4 GB 4 GB
• Max. displays
  2 2
• 一代人
  Vallhall 1 Bifrost 3
• 技术过程
  7 nm 7 nm
• 发布日期
  Q2/2020 Q3/2018

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• AV1
  Decode 没有
• AVC
  Decode / Encode Decode / Encode
• VC-1
  Decode / Encode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 990 4G 和 MediaTek Dimensity 6020. The supported memory frequencies may vary depending on the motherboard configuration.

• 存储器类型
  LPDDR4X-2133 LPDDR4X-2133
• 最大内存
  8 GB
• 记忆通道
  2 (Dual Channel) 4
• ECC
  没有 没有

Analyze the TDP (Thermal Design Power) requirements of MediaTek Dimensity 6020 和 HiSilicon Kirin 990 4G to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by MediaTek Dimensity 6020 和 HiSilicon Kirin 990 4G, including virtual machine technologies and fabrication processes.

• 技术过程
  7 nm 7 nm
• 插座
  -- N/A
• L2-Cache
  -- 2.00 MB
• 建筑学
  Cortex-A76 / Cortex-A55 Cortex-A76 / Cortex-A55
• 虚拟化
  None None
• 指令集（ISA）
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• 发布日期
  Q1/2023 Q3/2019