Intel Core2 Duo E6700 对 AMD Phenom II X4 B95. 规格、性能、测试

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 分段
  Desktop / Server Desktop / Server
• 系列
  Intel Core2 Duo AMD Phenom II
• 一代人
  1 4
• CPU组
  Intel Core 2 Duo AMD Phenom II - 800/900

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• 頻率
  2.66 GHz 3.00 GHz
• CPU核数
  2 4
• 涡轮增压 (1核)
  没有涡轮增压 没有涡轮增压
• CPU线程
  2 4
• 超线程
  没有 没有
• 超频
  是 是
• 核心架构
  normal normal

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名称
  没有iGPU 没有iGPU
• GPU (Turbo)
  没有涡轮增压 没有涡轮增压

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  没有 没有
• h265 / HEVC (10 bit)
  没有 没有
• h264
  没有 没有
• VP9
  没有 没有
• VP8
  没有 没有
• AV1
  没有 没有
• AVC
  没有 没有
• VC-1
  没有 没有
• JPEG
  没有 没有

Overview of the types and quantities of RAM supported by AMD Phenom II X4 B95 和 Intel Core2 Duo E6700. The supported memory frequencies may vary depending on the motherboard configuration.

• 存储器类型
  DDR2-1066 DDR2-1066
• ECC
  没有 没有
• 记忆通道
  1 2

• AES-NI
  没有 没有

Analyze the TDP (Thermal Design Power) requirements of Intel Core2 Duo E6700 和 AMD Phenom II X4 B95 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  65 W 95 W

Information on architecture, interfaces, and additional instructions supported by Intel Core2 Duo E6700 和 AMD Phenom II X4 B95, including virtual machine technologies and fabrication processes.

• 指令集（ISA）
  x86-64 (64 bit) x86-64 (64 bit)
• 虚拟化
  VT-x AMD-V
• ISA扩展
  SSE3 SSE3, SSE4a
• L2-Cache
  4.00 MB 6.00 MB
• 建筑学
  Conroe Deneb (K10)
• 技术过程
  65 nm 45 nm
• 插座
  LGA 775 AM3
• 发布日期
  Q3/2006 Q3/2009