HiSilicon Kirin 990 4G 对 Qualcomm Snapdragon 480 5G. 规格、性能、测试

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 分段
  Mobile Mobile
• 系列
  HiSilicon Kirin Qualcomm Snapdragon
• 一代人
  8 6
• CPU组
  HiSilicon Kirin 990 Qualcomm Snapdragon 480

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• 頻率
  1.86 GHz 1.80 GHz
• CPU核数
  8 8
• 涡轮增压 (1核)
  2.09 GHz 1.80 GHz
• CPU线程
  8 8
• Turbo (8 Cores)
  2.86 GHz 1.80 GHz
• 超线程
  没有 没有
• 超频
  没有 没有
• 核心架构
  hybrid (Prime / big.LITTLE) normal
• A core
  2x Cortex-A76 2x Kryo 460 Gold
• B core
  2x Cortex-A76 6x Kryo 460 Silver
• C core
  4x Cortex-A55 --

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名称
  ARM Mali-G76 MP16 Qualcomm Adreno 619
• GPU frequency
  0.60 GHz 0.95 GHz
• GPU (Turbo)
  没有涡轮增压 没有涡轮增压
• 执行单位
  16 0
• 着色器
  256 128
• Max. GPU Memory
  4 GB 4 GB
• Max. displays
  2 2
• 一代人
  Bifrost 3 6
• DirectX Version
  12 12.1
• 技术过程
  7 nm 8 nm
• 发布日期
  Q3/2018 Q2/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode / Encode Decode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode
• VP8
  Decode / Encode Decode
• AV1
  没有 没有
• AVC
  Decode / Encode Decode
• VC-1
  Decode / Encode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 480 5G 和 HiSilicon Kirin 990 4G. The supported memory frequencies may vary depending on the motherboard configuration.

• 存储器类型
  LPDDR4X-2133 LPDDR4X-2133
• 最大内存
  8 GB
• ECC
  没有 没有
• 记忆通道
  4 1

• AES-NI
  没有 没有

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 990 4G 和 Qualcomm Snapdragon 480 5G to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  6 W

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 990 4G 和 Qualcomm Snapdragon 480 5G, including virtual machine technologies and fabrication processes.

• 指令集（ISA）
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• 虚拟化
  None None
• L2-Cache
  2.00 MB --
• 建筑学
  Cortex-A76 / Cortex-A55 Kryo 460
• 技术过程
  7 nm 8 nm
• 插座
  N/A N/A
• 发布日期
  Q3/2019 Q1/2021
• Part Number
  -- SM4350