HiSilicon Kirin 655 对 Qualcomm Snapdragon 626. 规格、性能、测试

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 分段
  Mobile Mobile
• 系列
  HiSilicon Kirin Qualcomm Snapdragon
• 一代人
  4 3
• CPU组
  HiSilicon Kirin 650 Qualcomm Snapdragon 625/626

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• 頻率
  1.70 GHz 2.20 GHz
• CPU核数
  8 8
• 涡轮增压 (1核)
  2.12 GHz 2.20 GHz
• CPU线程
  8 8
• Turbo (8 Cores)
  2.12 GHz 2.20 GHz
• 超线程
  没有 没有
• 超频
  没有 没有
• 核心架构
  hybrid (big.LITTLE) normal
• A core
  4x Cortex-A53 --
• B core
  4x Cortex-A53 --

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名称
  ARM Mali-T830 MP2 Qualcomm Adreno 506
• GPU frequency
  0.90 GHz 0.65 GHz
• GPU (Turbo)
  0.90 GHz 0.65 GHz
• 执行单位
  2 0
• 着色器
  32 96
• Max. displays
  2 0
• 一代人
  Midgard 4 5
• DirectX Version
  11 11
• 技术过程
  28nm 14 nm
• 发布日期
  Q4/2015 Q4/2015

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode 没有
• h264
  Decode / Encode Decode / Encode
• VP9
  没有 没有
• VP8
  Decode / Encode 没有
• AV1
  没有 没有
• AVC
  没有 没有
• VC-1
  没有 Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 626 和 HiSilicon Kirin 655. The supported memory frequencies may vary depending on the motherboard configuration.

• 存储器类型
  LPDDR3-933 LPDDR3-933
• ECC
  没有 没有
• 记忆通道
  2 1

• AES-NI
  没有 没有

Analyze the TDP (Thermal Design Power) requirements of HiSilicon Kirin 655 和 Qualcomm Snapdragon 626 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by HiSilicon Kirin 655 和 Qualcomm Snapdragon 626, including virtual machine technologies and fabrication processes.

• 指令集（ISA）
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• 虚拟化
  None None
• 建筑学
  Cortex-A53 / Cortex-A53 Cortex-A53
• 技术过程
  16 nm 14 nm
• 插座
  N/A N/A
• 发布日期
  Q2/2016 Q4/2016
• Part Number
  -- MSM8953 Pro