Apple A11 Bionic 对 HiSilicon Kirin 990E 5G. 规格、性能、测试

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 分段
  Mobile Mobile
• 系列
  Apple A series HiSilicon Kirin
• 一代人
  11 8
• CPU组
  Apple A11 HiSilicon Kirin 990
• 过去的模式
  Apple A10 Fusion --
• Successor
  Apple A12 Bionic --

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• 頻率
  1.42 GHz 1.95 GHz
• CPU核数
  6 8
• 涡轮增压 (1核)
  2.39 GHz 2.36 GHz
• CPU线程
  6 8
• 超线程
  没有 没有
• 超频
  没有 没有
• 核心架构
  hybrid (big.LITTLE) hybrid (Prime / big.LITTLE)
• A core
  2x Monsoon 2x Cortex-A76
• B core
  4x Mistral 2x Cortex-A76
• C core
  -- 4x Cortex-A55

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名称
  Apple A11 ARM Mali-G76 MP14
• GPU frequency
  1.42 GHz 0.60 GHz
• GPU (Turbo)
  2.39 GHz 0.60 GHz
• 执行单位
  3 14
• 着色器
  0 224
• Max. GPU Memory
  3 GB 4 GB
• Max. displays
  1 2
• 一代人
  8 Bifrost 3
• DirectX Version
  12
• 技术过程
  10 nm 7 nm
• 发布日期
  Q3/2017 Q3/2018

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode / Encode
• h265 / HEVC (10 bit)
  Decode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• AV1
  没有 没有
• AVC
  Decode Decode / Encode
• VC-1
  Decode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 990E 5G 和 Apple A11 Bionic. The supported memory frequencies may vary depending on the motherboard configuration.

• 存储器类型
  LPDDR4X-4266 LPDDR4X-4266
• 最大内存
  16 GB 8 GB
• ECC
  没有 没有
• 记忆通道
  1 4

• AES-NI
  没有 没有

Analyze the TDP (Thermal Design Power) requirements of Apple A11 Bionic 和 HiSilicon Kirin 990E 5G to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  8 W 6 W

Information on architecture, interfaces, and additional instructions supported by Apple A11 Bionic 和 HiSilicon Kirin 990E 5G, including virtual machine technologies and fabrication processes.

• 指令集（ISA）
  x86-64 (64 bit) ARMv8-A64 (64 bit)
• 虚拟化
  None None
• L2-Cache
  8.00 MB --
• L2-Cache
  -- 2.00 MB
• 建筑学
  A11 Cortex-A76 / Cortex-A55
• 技术过程
  10 nm 7 nm
• 插座
  N/A N/A
• 发布日期
  Q3/2017 Q3/2019