AMD EPYC 7373X 对 AMD EPYC 7573X. 规格、性能、测试

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• 系列
  AMD EPYC AMD EPYC
• CPU组
  AMD EPYC 7003 AMD EPYC 7003
• 分段
  Desktop / Server Desktop / Server
• 一代人
  3 3

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  16 / 32 32 / 64
• 核心架构
  normal normal
• 磁芯
  16x Zen 3 32x Zen 3
• Hyperthreading / SMT
  是 是
• 超频
  没有 没有
• 頻率
  3.05 GHz 2.80 GHz
• Turbo Frequency (1 Core)
  3.80 GHz 3.60 GHz

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• GPU名称
  没有iGPU 没有iGPU
• GPU (Turbo)
  没有涡轮增压 没有涡轮增压

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  没有 没有
• h265 / HEVC (10 bit)
  没有 没有
• h264
  没有 没有
• VP8
  没有 没有
• VP9
  没有 没有
• AV1
  没有 没有
• AVC
  没有 没有
• VC-1
  没有 没有
• JPEG
  没有 没有

Overview of the types and quantities of RAM supported by AMD EPYC 7573X 和 AMD EPYC 7373X. The supported memory frequencies may vary depending on the motherboard configuration.

• 存储器类型
  DDR4-3200 DDR4-3200
• 最大内存
  4096 GB 4096 GB
• 记忆通道
  8 (Octa Channel) 8 (Octa Channel)
• Bandwidth
  204.8 GB/s 204.8 GB/s
• ECC
  是 是
• PCIe
  4.0 x 128 4.0 x 128
• AES-NI
  是 是

Analyze the TDP (Thermal Design Power) requirements of AMD EPYC 7373X 和 AMD EPYC 7573X to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  240 W 280 W
• TDP up
  280 W --
• TDP down
  225 W 225 W

Information on architecture, interfaces, and additional instructions supported by AMD EPYC 7373X 和 AMD EPYC 7573X, including virtual machine technologies and fabrication processes.

• 技术过程
  7 nm 7 nm
• Chip design
  Chiplet Chiplet
• 插座
  SP3 SP3
• L2-Cache
  32.00 MB 32.00 MB
• L2-Cache
  768.00 MB 768.00 MB
• 建筑学
  Milan (Zen 3) Milan (Zen 3)
• Operating systems
  Windows 10, Linux Windows 10, Linux
• 虚拟化
  AMD-V, SVM AMD-V, SVM
• 指令集（ISA）
  x86-64 (64 bit) x86-64 (64 bit)
• ISA扩展
  SSE4a, SSE4.1, SSE4.2, AVX2, FMA3 SSE4a, SSE4.1, SSE4.2, AVX2, FMA3
• 发布日期
  Q2/2022 Q2/2022
• Release price
  3900 $ 5590 $