UNISOC T770 versus MediaTek Helio G96. Especificações, desempenho, testes

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Série
  UNISOC 5G Mediatek Helio
• Grupo CPU
  UNISOC 5G 6nm MediaTek Helio G90
• Segmento
  Mobile Mobile
• Geração
  0 1

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Arquitectura central
  hybrid (Prime / big.LITTLE) hybrid (big.LITTLE)
• Overclocking
  Não Não

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nome da GPU
  ARM Mali-G57 MP4 ARM Mali-G57 MP2
• GPU frequency
  0.78 GHz 0.90 GHz
• GPU (Turbo)
  Sem turbo Sem turbo
• Unidades de execução
  4 2
• Shader
  64 32
• Max. GPU Memory
  4 GB 4 GB
• Max. displays
  2 2
• Geração
  Vallhall 1 Vallhall 1
• Processo técnico
  7 nm 7 nm
• Data de lançamento
  Q2/2020 Q2/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• AV1
  Decode Decode
• AVC
  Decode / Encode Decode / Encode
• VC-1
  Decode / Encode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by MediaTek Helio G96 e UNISOC T770. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo de memória
  LPDDR4-2133LPDDR4X-2133 LPDDR4X-2133
• Máx. Memória
  10 GB
• Canais de memória
  2 (Dual Channel) 2
• ECC
  Não Não

Analyze the TDP (Thermal Design Power) requirements of UNISOC T770 e MediaTek Helio G96 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by UNISOC T770 e MediaTek Helio G96, including virtual machine technologies and fabrication processes.

• Processo técnico
  6 nm 12 nm
• Socket
  -- N/A
• Arquitectura
  Cortex-A76 / Cortex-A55
• Virtualização
  None None
• Conjunto de instruções (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Extensões ISA
  --
• Data de lançamento
  Q1/2020 Q3/2021