Qualcomm Snapdragon 435 versus MediaTek Helio P70. Especificações, desempenho, testes

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segmento
  Mobile Mobile
• Série
  Qualcomm Snapdragon Mediatek Helio
• Geração
  3 3
• Grupo CPU
  Qualcomm Snapdragon 430 MediaTek Helio P60/P70

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Overclocking
  Não Não
• Arquitectura central
  normal hybrid (big.LITTLE)

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nome da GPU
  Qualcomm Adreno 505 ARM Mali-G72 MP3
• GPU frequency
  0.45 GHz 0.90 GHz
• GPU (Turbo)
  0.45 GHz Sem turbo
• Unidades de execução
  0 3
• Shader
  48 48
• Max. GPU Memory
  -- 2 GB
• Max. displays
  0 1
• Geração
  5 Bifrost 2
• Processo técnico
  28 nm 16 nm
• Data de lançamento
  Q4/2015 Q3/2017

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode / Encode
• h265 / HEVC (10 bit)
  Não Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP9
  Não Decode / Encode
• VP8
  Não Decode / Encode
• AV1
  Não Não
• AVC
  Não Decode / Encode
• VC-1
  Decode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by MediaTek Helio P70 e Qualcomm Snapdragon 435. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo de memória
  LPDDR3-800 LPDDR4X-1800
• Máx. Memória
  8 GB
• ECC
  Não Não
• Canais de memória
  1 2

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 435 e MediaTek Helio P70 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 435 e MediaTek Helio P70, including virtual machine technologies and fabrication processes.

• Conjunto de instruções (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Virtualização
  None None
• Arquitectura
  Cortex-A53 Cortex-A73 / Cortex-A53
• Processo técnico
  28 nm 12 nm
• Socket
  N/A N/A
• Data de lançamento
  Q4/2016 Q2/2020
• Part Number
  MSM8940 --