Qualcomm Snapdragon 410 versus MediaTek Helio G85. Especificações, desempenho, testes

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Série
  Qualcomm Snapdragon Mediatek Helio
• Grupo CPU
  Qualcomm Snapdragon 410 MediaTek Helio G70/G80
• Segmento
  Mobile Mobile
• Geração
  2 1

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Arquitectura central
  normal hybrid (big.LITTLE)
• Frequência
  1.20 GHz 1.80 GHz
• Turbo (1 núcleo)
  1.20 GHz 2.00 GHz
• Hyperthreading
  Não Não
• Overclocking
  Não Não

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nome da GPU
  Qualcomm Adreno 306 ARM Mali-G52 MP2
• GPU frequency
  0.40 GHz 1.00 GHz
• GPU (Turbo)
  0.40 GHz Sem turbo
• Unidades de execução
  0 2
• Shader
  24 32
• Max. displays
  0 2
• Geração
  3 Bifrost 2
• Processo técnico
  28 nm 16 nm
• Data de lançamento
  Q3/2012 Q3/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode / Encode
• h265 / HEVC (10 bit)
  Não Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Não Decode / Encode
• VP9
  Não Decode / Encode
• AV1
  Não Não
• AVC
  Não Decode / Encode
• VC-1
  Decode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by MediaTek Helio G85 e Qualcomm Snapdragon 410. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo de memória
  LPDDR2-533LPDDR3-533 LPDDR4X-1800
• Máx. Memória
  8 GB
• Canais de memória
  1 2
• ECC
  Não Não

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 410 e MediaTek Helio G85 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  --

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 410 e MediaTek Helio G85, including virtual machine technologies and fabrication processes.

• Conjunto de instruções (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Extensões ISA
  --
• Arquitectura
  Cortex-A53 Cortex-A75 / Cortex-A55
• Processo técnico
  28 nm 12 nm
• Virtualização
  None None
• Socket
  N/A N/A
• Data de lançamento
  2014 Q2/2020
• Part Number
  APQ8016 MT6769Z