MediaTek Dimensity 930 versus Qualcomm Snapdragon 8 Gen 1. Especificações, desempenho, testes

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Série
  Mediatek Dimensity Qualcomm Snapdragon
• Grupo CPU
  MediaTek Dimensity 900 Qualcomm Snapdragon 8 Gen 1
• Segmento
  Mobile Mobile
• Geração
  2 1
• Modelo passado
  -- Qualcomm Snapdragon 888

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  8 / 8 8 / 8
• Arquitectura central
  hybrid (big.LITTLE) hybrid (Prime / big.LITTLE)
• A-Core
  2x Cortex-A78 1x Cortex-X2
• B-Core
  6x Cortex-A55 3x Cortex-A710
• Overclocking
  Não Não

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nome da GPU
  PowerVR IMG AXM-8-256 Qualcomm Adreno 730
• GPU frequency
  1.00 GHz 0.84 GHz
• GPU (Turbo)
  Sem turbo Sem turbo
• Unidades de execução
  8 0
• Geração
  10 7
• Direct X
  -- 12.1
• Processo técnico
  0 4 nm
• Data de lançamento
  Q4/2019 Q1/2022

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Não Decode / Encode
• VP9
  Não Decode / Encode
• AV1
  Não Não
• AVC
  Não Decode
• VC-1
  Não Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 8 Gen 1 e MediaTek Dimensity 930. The supported memory frequencies may vary depending on the motherboard configuration.

• Tipo de memória
  LPDDR5-6400 LPDDR5-3200
• Máx. Memória
  16 GB 16 GB
• Canais de memória
  4 (Quad Channel) 4
• ECC
  Não Não
• AES-NI
  Não Não

Analyze the TDP (Thermal Design Power) requirements of MediaTek Dimensity 930 e Qualcomm Snapdragon 8 Gen 1 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by MediaTek Dimensity 930 e Qualcomm Snapdragon 8 Gen 1, including virtual machine technologies and fabrication processes.

• Processo técnico
  6 nm 4 nm
• Socket
  -- N/A
• Кеш L2
  -- 2.00 MB
• Кеш L3
  -- 4.00 MB
• Arquitectura
  Cortex-A78 / Cortex-A55 Kryo
• Virtualização
  None None
• Conjunto de instruções (ISA)
  ARMv8-A64 (64 bit) ARMv9-A64 (64 bit)
• Data de lançamento
  Q3/2022 Q1/2022
• Part Number
  MT6878 SM8450