Samsung Exynos 990 kontra MediaTek Helio G96. Specyfikacje, wydajność, testy

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Seria
  Samsung Exynos Mediatek Helio
• Grupa CPU
  Samsung Exynos 990 MediaTek Helio G90
• Segment
  Mobile Mobile
• Pokolenie
  4 1

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Architektura podstawowa
  hybrid (Prime / big.LITTLE) hybrid (big.LITTLE)
• Częstotliwość
  2.00 GHz 2.00 GHz
• Turbo (1 rdzeń)
  2.73 GHz 2.05 GHz
• Turbo (8 Cores)
  2.73 GHz 2.00 GHz
• Hyperthreading
  Nie Nie
• Overclocking
  Nie Nie

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nazwa procesora graficznego
  ARM Mali-G77 MP11 ARM Mali-G57 MP2
• GPU frequency
  0.80 GHz 0.90 GHz
• GPU (Turbo)
  No turbo No turbo
• Jednostki wykonawcze
  11 2
• Shader
  176 32
• Max. GPU Memory
  4 GB 4 GB
• Max. displays
  1 2
• Pokolenie
  Vallhall 1 Vallhall 1
• Proces technologiczny
  7 nm 7 nm
• Data wydania
  Q2/2019 Q2/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• AV1
  Decode Decode
• AVC
  Decode / Encode Decode / Encode
• VC-1
  Decode / Encode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by MediaTek Helio G96 oraz Samsung Exynos 990. The supported memory frequencies may vary depending on the motherboard configuration.

• Typ pamięci
  LPDDR5-2750 LPDDR4X-2133
• Max. Pamięć
  12 GB 10 GB
• Kanały pamięci
  4 2
• ECC
  Nie Nie

Analyze the TDP (Thermal Design Power) requirements of Samsung Exynos 990 oraz MediaTek Helio G96 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  --

Information on architecture, interfaces, and additional instructions supported by Samsung Exynos 990 oraz MediaTek Helio G96, including virtual machine technologies and fabrication processes.

• Zestaw instrukcji (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Rozszerzenia ISA
  --
• L2-Cache
  1.50 MB --
• L3-Cache
  2.00 MB --
• Architektura
  Exynos M5/Cortex-A76/-A55 Cortex-A76 / Cortex-A55
• Proces technologiczny
  7 nm 12 nm
• Wirtualizacja
  None None
• Gniazdo
  N/A N/A
• Data wydania
  Q1/2020 Q3/2021