Qualcomm Snapdragon 8cx kontra HiSilicon Kirin 985 5G. Specyfikacje, wydajność, testy

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Seria
  Qualcomm Snapdragon HiSilicon Kirin
• Grupa CPU
  Qualcomm Snapdragon 8cx HiSilicon Kirin 980
• Segment
  Mobile Mobile
• Pokolenie
  3 7

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Architektura podstawowa
  hybrid (big.LITTLE) hybrid (Prime / big.LITTLE)
• Częstotliwość
  1.80 GHz 1.84 GHz
• Turbo (1 rdzeń)
  2.84 GHz 2.40 GHz
• Turbo (8 Cores)
  2.84 GHz 2.58 GHz
• Hyperthreading
  Nie Nie
• Overclocking
  Nie Nie

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nazwa procesora graficznego
  Qualcomm Adreno 680 ARM Mali-G77 MP8
• GPU frequency
  0.25 GHz 0.80 GHz
• GPU (Turbo)
  0.59 GHz No turbo
• Jednostki wykonawcze
  8 8
• Shader
  768 128
• Max. GPU Memory
  4 GB 4 GB
• Max. displays
  2 1
• Pokolenie
  5 Vallhall 1
• Proces technologiczny
  7 nm 7 nm
• Data wydania
  Q4/2018 Q2/2019

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode Decode / Encode
• AV1
  Nie Decode
• AVC
  Decode Decode / Encode
• VC-1
  Decode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by HiSilicon Kirin 985 5G oraz Qualcomm Snapdragon 8cx. The supported memory frequencies may vary depending on the motherboard configuration.

• Typ pamięci
  LPDDR4X-2133 LPDDR4X-2133
• Max. Pamięć
  16 GB
• Kanały pamięci
  8 4
• ECC
  Nie Nie

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 8cx oraz HiSilicon Kirin 985 5G to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  7 W

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 8cx oraz HiSilicon Kirin 985 5G, including virtual machine technologies and fabrication processes.

• Zestaw instrukcji (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• L3-Cache
  2.00 MB --
• Architektura
  Kryo 495 Cortex-A76 / Cortex-A55
• Proces technologiczny
  7 nm 7 nm
• Wirtualizacja
  None None
• Gniazdo
  N/A N/A
• Data wydania
  Q4/2018 Q2/2020
• Part Number
  -- Hi6290