Qualcomm Snapdragon 845 kontra Qualcomm Snapdragon 850. Specyfikacje, wydajność, testy

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Seria
  Qualcomm Snapdragon Qualcomm Snapdragon
• Pokolenie
  5 5
• Grupa CPU
  Qualcomm Snapdragon 845 Qualcomm Snapdragon 845

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Częstotliwość
  1.80 GHz 1.80 GHz
• Rdzenie CPU
  8 8
• Turbo (1 rdzeń)
  2.80 GHz 2.95 GHz
• CPU Threads
  8 8
• Turbo (8 Cores)
  2.80 GHz 2.95 GHz
• Hyperthreading
  Nie Nie
• Overclocking
  Nie Nie
• Architektura podstawowa
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A core
  4x Kryo 385 Gold 4x Kryo 385 Gold
• B core
  4x Kryo 385 Silver 4x Kryo 385 Silver

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nazwa procesora graficznego
  Qualcomm Adreno 630 Qualcomm Adreno 630
• GPU frequency
  0.70 GHz 0.70 GHz
• GPU (Turbo)
  No turbo No turbo
• Shader
  256 256
• Max. GPU Memory
  8 GB 8 GB
• Max. displays
  2 2
• Pokolenie
  4 4
• DirectX Version
  11 11
• Proces technologiczny
  10 nm 10 nm
• Data wydania
  Q1/2018 Q1/2018

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode
• h265 / HEVC (10 bit)
  Decode Decode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode Decode
• VP8
  Decode Decode
• AV1
  Nie Nie
• AVC
  Decode Decode
• VC-1
  Decode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 850 oraz Qualcomm Snapdragon 845. The supported memory frequencies may vary depending on the motherboard configuration.

• Typ pamięci
  LPDDR4X-1866 LPDDR4X-1866
• Max. Pamięć
  8 GB 8 GB
• ECC
  Nie Nie
• Kanały pamięci
  4 4

• AES-NI
  Nie Nie

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 845 oraz Qualcomm Snapdragon 850 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 845 oraz Qualcomm Snapdragon 850, including virtual machine technologies and fabrication processes.

• Zestaw instrukcji (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Wirtualizacja
  None None
• L2-Cache
  0.51 MB --
• L3-Cache
  2.00 MB --
• Architektura
  Kryo 385 Kryo 385
• Proces technologiczny
  10 nm 10 nm
• Gniazdo
  N/A N/A
• Data wydania
  Q1/2018 Q3/2018
• Part Number
  SDM845 SDM850