Qualcomm Snapdragon 460 kontra Qualcomm Snapdragon 662. Specyfikacje, wydajność, testy

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Seria
  Qualcomm Snapdragon Qualcomm Snapdragon
• Pokolenie
  5 7
• Grupa CPU
  Qualcomm Snapdragon 460 Qualcomm Snapdragon 662/665

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Częstotliwość
  1.80 GHz 1.80 GHz
• Rdzenie CPU
  8 8
• Turbo (1 rdzeń)
  1.80 GHz 2.00 GHz
• CPU Threads
  8 8
• Turbo (8 Cores)
  1.80 GHz 1.80 GHz
• Hyperthreading
  Nie Nie
• Overclocking
  Nie Nie
• Architektura podstawowa
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A core
  4x Kryo 240 Gold 4x Kryo 260 Gold
• B core
  4x Kryo 240 Silver 4x Kryo 260 Silver

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nazwa procesora graficznego
  Qualcomm Adreno 610 Qualcomm Adreno 610
• GPU (Turbo)
  No turbo No turbo
• Shader
  128 128
• Max. GPU Memory
  4 GB 4 GB
• Pokolenie
  6 6
• DirectX Version
  12.1 12.1
• Proces technologiczny
  11 nm 11 nm
• Data wydania
  Q2/2019 Q2/2019

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode
• h265 / HEVC (10 bit)
  Decode Decode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode Decode
• VP8
  Decode Decode
• AV1
  Nie Nie
• AVC
  Decode Decode
• VC-1
  Decode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 662 oraz Qualcomm Snapdragon 460. The supported memory frequencies may vary depending on the motherboard configuration.

• Typ pamięci
  LPDDR3-933LPDDR4X-1866 LPDDR3-933LPDDR4X-1866
• ECC
  Nie Nie
• Kanały pamięci
  1 2

• AES-NI
  Nie Nie

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 460 oraz Qualcomm Snapdragon 662 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 460 oraz Qualcomm Snapdragon 662, including virtual machine technologies and fabrication processes.

• Zestaw instrukcji (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Wirtualizacja
  None None
• Architektura
  Kryo 240 Kryo 260
• Proces technologiczny
  11 nm 11 nm
• Gniazdo
  N/A N/A
• Data wydania
  Q1/2020 Q1/2020
• Part Number
  SM4250-AA SM6115