Qualcomm Snapdragon 427 kontra Qualcomm Snapdragon 430. Specyfikacje, wydajność, testy

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Seria
  Qualcomm Snapdragon Qualcomm Snapdragon
• Pokolenie
  3 3
• Grupa CPU
  Qualcomm Snapdragon 425/427 Qualcomm Snapdragon 430

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Częstotliwość
  1.40 GHz 1.40 GHz
• Rdzenie CPU
  4 8
• Turbo (1 rdzeń)
  1.40 GHz 1.40 GHz
• CPU Threads
  4 8
• Hyperthreading
  Nie Nie
• Overclocking
  Nie Nie
• Architektura podstawowa
  normal normal

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nazwa procesora graficznego
  Qualcomm Adreno 308 Qualcomm Adreno 505
• GPU frequency
  0.50 GHz 0.45 GHz
• GPU (Turbo)
  0.50 GHz 0.45 GHz
• Shader
  24 48
• Pokolenie
  3 5
• DirectX Version
  11 11
• Proces technologiczny
  28 nm 28 nm
• Data wydania
  Q1/2016 Q4/2015

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode Decode
• h265 / HEVC (10 bit)
  Nie Nie
• h264
  Decode / Encode Decode / Encode
• VP9
  Nie Nie
• VP8
  Nie Nie
• AV1
  Nie Nie
• AVC
  Nie Nie
• VC-1
  Decode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 430 oraz Qualcomm Snapdragon 427. The supported memory frequencies may vary depending on the motherboard configuration.

• Typ pamięci
  LPDDR3-667 LPDDR3-800
• ECC
  Nie Nie
• Kanały pamięci
  1 1

• AES-NI
  Nie Nie

Analyze the TDP (Thermal Design Power) requirements of Qualcomm Snapdragon 427 oraz Qualcomm Snapdragon 430 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by Qualcomm Snapdragon 427 oraz Qualcomm Snapdragon 430, including virtual machine technologies and fabrication processes.

• Zestaw instrukcji (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Wirtualizacja
  None None
• Architektura
  Cortex-A53 Cortex-A53
• Proces technologiczny
  28 nm 28 nm
• Gniazdo
  N/A N/A
• Data wydania
  Q1/2017 Q2/2016
• Part Number
  MSM8920 MSM8937