MediaTek Kompanio 500 kontra MediaTek Helio G80. Specyfikacje, wydajność, testy

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Seria
  Mediatek Kompanio Mediatek Helio
• Grupa CPU
  MediaTek Kompanio 500 MediaTek Helio G70/G80
• Segment
  Mobile Mobile
• Pokolenie
  1 1

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Architektura podstawowa
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• Overclocking
  Nie Nie

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nazwa procesora graficznego
  ARM Mali-G72 MP3 ARM Mali-G52 MP2
• GPU frequency
  0.80 GHz 0.95 GHz
• GPU (Turbo)
  No turbo No turbo
• Jednostki wykonawcze
  3 2
• Shader
  48 32
• Max. GPU Memory
  2 GB --
• Max. displays
  1 2
• Pokolenie
  Bifrost 2 Bifrost 2
• Proces technologiczny
  16 nm 16 nm
• Data wydania
  Q3/2017 Q3/2020

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• AV1
  Nie Nie
• AVC
  Decode / Encode Decode / Encode
• VC-1
  Decode / Encode Decode / Encode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by MediaTek Helio G80 oraz MediaTek Kompanio 500. The supported memory frequencies may vary depending on the motherboard configuration.

• Typ pamięci
  LPDDR3LPDDR4X LPDDR4X-1800
• Max. Pamięć
  8 GB
• Kanały pamięci
  Shadow of the Tomb Raider has a built-in benchmark, bSilnik ten obsługuje realistyczne wyświetlanie postaci i otoczenia. 2
• ECC
  Nie Nie

Analyze the TDP (Thermal Design Power) requirements of MediaTek Kompanio 500 oraz MediaTek Helio G80 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  --

Information on architecture, interfaces, and additional instructions supported by MediaTek Kompanio 500 oraz MediaTek Helio G80, including virtual machine technologies and fabrication processes.

• Zestaw instrukcji (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Rozszerzenia ISA
  --
• Architektura
  Cortex-A73 / Cortex-A53 Cortex-A75 / Cortex-A55
• Proces technologiczny
  12 nm 12 nm
• Wirtualizacja
  None None
• Gniazdo
  N/A N/A
• Data wydania
  Q4/2019 Q2/2020
• Part Number
  MT8183 MT6769T