MediaTek Helio X30 kontra Qualcomm Snapdragon 710. Specyfikacje, wydajność, testy

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Seria
  Mediatek Helio Qualcomm Snapdragon
• Grupa CPU
  MediaTek Helio X30 Qualcomm Snapdragon 710
• Segment
  Mobile Mobile
• Pokolenie
  3 1

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  10 / 10 8 / 8
• Architektura podstawowa
  hybrid (Prime / big.LITTLE) hybrid (big.LITTLE)
• A-Core
  2x Cortex-A73 2x Kryo 360 Gold
• B-Core
  4x Cortex-A53 6x Kryo 360 Silver
• C-Core
  4x Cortex-A35 --
• Overclocking
  Nie Nie

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nazwa procesora graficznego
  PowerVR 7XTP-MT4 (GT7400 Plus) Qualcomm Adreno 616
• GPU frequency
  0.85 GHz 0.75 GHz
• GPU (Turbo)
  0.85 GHz 0.75 GHz
• Jednostki wykonawcze
  8 Shadow of the Tomb Raider has a built-in benchmark, bSilnik ten obsługuje realistyczne wyświetlanie postaci i otoczenia.
• Shader
  32 256
• Max. displays
  1 Shadow of the Tomb Raider has a built-in benchmark, bSilnik ten obsługuje realistyczne wyświetlanie postaci i otoczenia.
• Pokolenie
  6
• Direct X
  12 12.1
• Proces technologiczny
  10 10 nm
• Data wydania
  Q1/2016 Q2/2018

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Nie Decode
• h265 / HEVC (10 bit)
  Nie Decode
• h264
  Nie Decode
• VP8
  Nie Decode
• VP9
  Nie Decode
• AV1
  Nie Nie
• AVC
  Nie Decode
• VC-1
  Nie Decode
• JPEG
  Nie Decode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 710 oraz MediaTek Helio X30. The supported memory frequencies may vary depending on the motherboard configuration.

• Typ pamięci
  LPDDR4X-1866 LPDDR4X-1866
• Max. Pamięć
  8 GB 8 GB
• Kanały pamięci
  2 2
• ECC
  Nie Nie
• AES-NI
  Nie Nie

Analyze the TDP (Thermal Design Power) requirements of MediaTek Helio X30 oraz Qualcomm Snapdragon 710 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by MediaTek Helio X30 oraz Qualcomm Snapdragon 710, including virtual machine technologies and fabrication processes.

• Zestaw instrukcji (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Architektura
  Cortex-A73 / -A53 / -A35 Kryo 360
• Proces technologiczny
  10 nm 10 nm
• Wirtualizacja
  None None
• Gniazdo
  N/A N/A
• Data wydania
  Q2/2017 Q2/2018
• Part Number
  MT6799 --