MediaTek Helio P18 kontra Qualcomm Snapdragon 650. Specyfikacje, wydajność, testy

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Seria
  Mediatek Helio Qualcomm Snapdragon
• Grupa CPU
  MediaTek Helio P10 Qualcomm Snapdragon 650
• Segment
  Mobile Mobile
• Pokolenie
  1 4

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Architektura podstawowa
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• Overclocking
  Nie Nie

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nazwa procesora graficznego
  ARM Mali-T860 MP2 Qualcomm Adreno 510
• GPU frequency
  0.80 GHz 0.60 GHz
• GPU (Turbo)
  0.80 GHz 0.60 GHz
• Jednostki wykonawcze
  2 Shadow of the Tomb Raider has a built-in benchmark, bSilnik ten obsługuje realistyczne wyświetlanie postaci i otoczenia.
• Shader
  32 128
• Max. displays
  2 Shadow of the Tomb Raider has a built-in benchmark, bSilnik ten obsługuje realistyczne wyświetlanie postaci i otoczenia.
• Pokolenie
  Midgard 4 5
• Proces technologiczny
  28nm 14 nm
• Data wydania
  Q4/2015 Q4/2015

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode
• h265 / HEVC (10 bit)
  Decode Nie
• h264
  Decode / Encode Decode
• VP8
  Decode / Encode Decode
• VP9
  Nie Decode
• AV1
  Nie Nie
• AVC
  Nie Nie
• VC-1
  Nie Decode
• JPEG
  Decode / Encode Decode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 650 oraz MediaTek Helio P18. The supported memory frequencies may vary depending on the motherboard configuration.

• Typ pamięci
  LPDDR3-933 LPDDR3-933
• Max. Pamięć
  4 GB
• Kanały pamięci
  1 2
• ECC
  Nie Nie

Analyze the TDP (Thermal Design Power) requirements of MediaTek Helio P18 oraz Qualcomm Snapdragon 650 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by MediaTek Helio P18 oraz Qualcomm Snapdragon 650, including virtual machine technologies and fabrication processes.

• Zestaw instrukcji (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Architektura
  Cortex-A53 Cortex-A72 / Cortex-A53
• Proces technologiczny
  28 nm 28 nm
• Wirtualizacja
  None None
• Gniazdo
  N/A N/A
• Data wydania
  Q1/2018 Q1/2016
• Part Number
  MT6755S MSM8956