MediaTek Helio G96 kontra MediaTek Helio G25. Specyfikacje, wydajność, testy

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Seria
  Mediatek Helio Mediatek Helio
• Pokolenie
  1 1
• Grupa CPU
  MediaTek Helio G90 MediaTek Helio G25/G35

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Hyperthreading
  Nie Nie
• Overclocking
  Nie Nie
• Architektura podstawowa
  hybrid (big.LITTLE) hybrid (big.LITTLE)
• A core
  2x Cortex-A76 4x Cortex-A53
• B core
  6x Cortex-A55 4x Cortex-A53

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nazwa procesora graficznego
  ARM Mali-G57 MP2 PowerVR GE8320
• GPU frequency
  0.90 GHz 0.65 GHz
• GPU (Turbo)
  No turbo No turbo
• Jednostki wykonawcze
  2 1
• Shader
  32 --
• Max. GPU Memory
  4 GB --
• Max. displays
  2 1
• Pokolenie
  Vallhall 1 --
• DirectX Version
  12 10
• Proces technologiczny
  7 nm 20 nm
• Data wydania
  Q2/2020 Q1/2017

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Nie
• h265 / HEVC (10 bit)
  Decode / Encode Nie
• h264
  Decode / Encode Nie
• VP9
  Decode / Encode Nie
• VP8
  Decode / Encode Nie
• AV1
  Decode Nie
• AVC
  Decode / Encode Nie
• VC-1
  Decode / Encode Nie
• JPEG
  Decode / Encode Nie

Overview of the types and quantities of RAM supported by MediaTek Helio G25 oraz MediaTek Helio G96. The supported memory frequencies may vary depending on the motherboard configuration.

• Typ pamięci
  LPDDR4X-2133 LPDDR3-933LPDDR4X-1600
• Max. Pamięć
  10 GB 6 GB
• ECC
  Nie Nie
• Kanały pamięci
  2 1

• AES-NI
  Nie Nie

Analyze the TDP (Thermal Design Power) requirements of MediaTek Helio G96 oraz MediaTek Helio G25 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

Information on architecture, interfaces, and additional instructions supported by MediaTek Helio G96 oraz MediaTek Helio G25, including virtual machine technologies and fabrication processes.

• Zestaw instrukcji (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Wirtualizacja
  None None
• Architektura
  Cortex-A76 / Cortex-A55 Cortex-A53 / Cortex-A53
• Proces technologiczny
  12 nm 12 nm
• Gniazdo
  N/A N/A
• Data wydania
  Q3/2021 Q2/2020
• Part Number
  -- MT6762G