MediaTek Dimensity 900 kontra Qualcomm Snapdragon 870. Specyfikacje, wydajność, testy

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Seria
  Mediatek Dimensity Qualcomm Snapdragon
• Pokolenie
  2 7
• Grupa CPU
  MediaTek Dimensity 900/920 Qualcomm Snapdragon 865/870

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Częstotliwość
  2.00 GHz 1.80 GHz
• Rdzenie CPU
  8 8
• Turbo (1 rdzeń)
  2.40 GHz 3.20 GHz
• CPU Threads
  8 8
• Turbo (8 Cores)
  2.00 GHz 2.42 GHz
• Hyperthreading
  Nie Nie
• Overclocking
  Nie Nie
• Architektura podstawowa
  hybrid (big.LITTLE) hybrid (Prime / big.LITTLE)
• A core
  2x Cortex-A78 1x Kryo 585 Prime
• B core
  6x Cortex-A55 3x Kryo 585 Gold
• C core
  -- 4x Kryo 585 Silver

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nazwa procesora graficznego
  ARM Mali-G68 MP4 Qualcomm Adreno 650
• GPU frequency
  0.85 GHz 0.25 GHz
• GPU (Turbo)
  No turbo 0.67 GHz
• Jednostki wykonawcze
  4 2
• Shader
  64 512
• Max. displays
  1 1
• Pokolenie
  Vallhall 2 6
• DirectX Version
  12 12.0
• Proces technologiczny
  6 nm 7 nm
• Data wydania
  Q2/2020 Q4/2019

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Decode / Encode Decode / Encode
• h265 / HEVC (10 bit)
  Decode / Encode Decode / Encode
• h264
  Decode / Encode Decode / Encode
• VP9
  Decode / Encode Decode / Encode
• VP8
  Decode / Encode Decode / Encode
• AV1
  Decode Nie
• AVC
  Decode / Encode Decode
• VC-1
  Decode / Encode Decode
• JPEG
  Decode / Encode Decode / Encode

Overview of the types and quantities of RAM supported by Qualcomm Snapdragon 870 oraz MediaTek Dimensity 900. The supported memory frequencies may vary depending on the motherboard configuration.

• Typ pamięci
  LPDDR4XLPDDR5 LPDDR4X-4266LPDDR5-5500
• Max. Pamięć
  16 GB 16 GB
• ECC
  Nie Nie
• Kanały pamięci
  4 4

• AES-NI
  Nie Nie

Analyze the TDP (Thermal Design Power) requirements of MediaTek Dimensity 900 oraz Qualcomm Snapdragon 870 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  10 W 10 W

Information on architecture, interfaces, and additional instructions supported by MediaTek Dimensity 900 oraz Qualcomm Snapdragon 870, including virtual machine technologies and fabrication processes.

• Zestaw instrukcji (ISA)
  ARMv8-A64 (64 bit) ARMv8-A64 (64 bit)
• Wirtualizacja
  None None
• L2-Cache
  -- 2.00 MB
• L3-Cache
  2.00 MB 3.00 MB
• Architektura
  Cortex-A78 / Cortex-A55 Kryo 585
• Proces technologiczny
  6 nm 7 nm
• Gniazdo
  N/A N/A
• Data wydania
  Q2/2021 Q2/2021
• Part Number
  MT6877 SM8250-AC