Intel Xeon W-3175X kontra MediaTek Dimensity 1100. Specyfikacje, wydajność, testy

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Desktop / Server Mobile
• Seria
  Intel Xeon W Mediatek Dimensity
• Pokolenie
  6 2
• Grupa CPU
  Intel Xeon W-2100/3100 MediaTek Dimensity 1100/1200
• Successor
  Intel Xeon W-3275 --

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Częstotliwość
  3.10 GHz 2.00 GHz
• Rdzenie CPU
  28 8
• Turbo (1 rdzeń)
  3.80 GHz 2.60 GHz
• CPU Threads
  56 8
• Hyperthreading
  Tak Nie
• Overclocking
  Tak Nie
• Architektura podstawowa
  normal hybrid (big.LITTLE)
• A core
  -- 4x Cortex-A78
• B core
  -- 4x Cortex-A55

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nazwa procesora graficznego
  brak iGPU ARM Mali-G77 MP9
• GPU frequency
  0.85 GHz
• GPU (Turbo)
  No turbo No turbo
• Jednostki wykonawcze
  9
• Shader
  144
• Max. GPU Memory
  -- 4 GB
• Max. displays
  1
• Pokolenie
  Vallhall 1
• DirectX Version
  12
• Proces technologiczny
  7 nm
• Data wydania
  Q2/2019

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Nie Decode / Encode
• h265 / HEVC (10 bit)
  Nie Decode / Encode
• h264
  Nie Decode / Encode
• VP9
  Nie Decode / Encode
• VP8
  Nie Decode / Encode
• AV1
  Nie Decode
• AVC
  Nie Decode / Encode
• VC-1
  Nie Decode / Encode
• JPEG
  Nie Decode / Encode

Overview of the types and quantities of RAM supported by MediaTek Dimensity 1100 oraz Intel Xeon W-3175X. The supported memory frequencies may vary depending on the motherboard configuration.

• Typ pamięci
  DDR4-2666 LPDDR4X-2133
• Max. Pamięć
  512 GB
• ECC
  Tak Nie
• Kanały pamięci
  6 4
• Wersja PCIe
  3.0
• Pasma PCIe
  48

• AES-NI
  Tak Nie

Analyze the TDP (Thermal Design Power) requirements of Intel Xeon W-3175X oraz MediaTek Dimensity 1100 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  255 W
• Temperatura maksymalna
  85 °C --

Information on architecture, interfaces, and additional instructions supported by Intel Xeon W-3175X oraz MediaTek Dimensity 1100, including virtual machine technologies and fabrication processes.

• Zestaw instrukcji (ISA)
  x86-64 (64 bit) ARMv8-A64 (64 bit)
• Wirtualizacja
  VT-x, VT-x EPT, VT-d None
• Rozszerzenia ISA
  SSE4.1, SSE4.2, AVX2, AVX-512
• L3-Cache
  38.50 MB --
• Architektura
  Skylake W Cortex-A78 / Cortex-A55
• Proces technologiczny
  14 nm 6 nm
• Gniazdo
  LGA 3647 N/A
• Data wydania
  Q4/2018 Q1/2021
• Part Number
  -- MT6891Z/CZA