Intel Core i3-2350M kontra Intel Core i3-2367M. Specyfikacje, wydajność, testy

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Segment
  Mobile Mobile
• Seria
  Intel Core i3 Intel Core i3
• Pokolenie
  2 2
• Grupa CPU
  Intel Core i 2000M Intel Core i 2000M

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• Częstotliwość
  2.30 GHz 1.40 GHz
• Rdzenie CPU
  2 2
• Turbo (1 rdzeń)
  No turbo No turbo
• CPU Threads
  4 4
• Turbo (2 Cores)
  No turbo No turbo
• Hyperthreading
  Tak Tak
• Overclocking
  Nie Nie
• Architektura podstawowa
  normal normal

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nazwa procesora graficznego
  Intel HD Graphics 3000 Intel HD Graphics 3000
• GPU frequency
  0.65 GHz 0.35 GHz
• GPU (Turbo)
  1.15 GHz 1.00 GHz
• Jednostki wykonawcze
  12 12
• Shader
  96 96
• Max. displays
  2 2
• Pokolenie
  6 6
• DirectX Version
  10.1 10.1
• Proces technologiczny
  32 nm 32 nm
• Data wydania
  Q1/2011 Q1/2011

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Nie Nie
• h265 / HEVC (10 bit)
  Nie Nie
• h264
  Decode / Encode Decode / Encode
• VP9
  Nie Nie
• VP8
  Nie Nie
• AV1
  Nie Nie
• AVC
  Decode / Encode Decode / Encode
• VC-1
  Decode Decode
• JPEG
  Nie Nie

Overview of the types and quantities of RAM supported by Intel Core i3-2367M oraz Intel Core i3-2350M. The supported memory frequencies may vary depending on the motherboard configuration.

• Typ pamięci
  DDR3-1066DDR3-1333 DDR3-1066DDR3-1333
• Max. Pamięć
  16 GB
• ECC
  Nie Tak
• Kanały pamięci
  2 2
• Wersja PCIe
  2.0 2.0
• Pasma PCIe
  16 16

• AES-NI
  Tak Tak

Analyze the TDP (Thermal Design Power) requirements of Intel Core i3-2350M oraz Intel Core i3-2367M to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  35 W 17 W
• Temperatura maksymalna
  -- 100 °C

Information on architecture, interfaces, and additional instructions supported by Intel Core i3-2350M oraz Intel Core i3-2367M, including virtual machine technologies and fabrication processes.

• Zestaw instrukcji (ISA)
  x86-64 (64 bit) x86-64 (64 bit)
• Wirtualizacja
  VT-x, VT-x EPT VT-x, VT-x EPT
• Rozszerzenia ISA
  SSE4.1, SSE4.2, AVX SSE4.1, SSE4.2, AVX
• L3-Cache
  3.00 MB 3.00 MB
• Architektura
  Sandy Bridge H Sandy Bridge H
• Proces technologiczny
  32 nm 32 nm
• Gniazdo
  PPGA 988 BGA 1023
• Data wydania
  Q4/2011 Q4/2011