AMD Ryzen Embedded V3C16 kontra AMD EPYC 9554. Specyfikacje, wydajność, testy

Comprehensive background on the processors being compared, detailing their series, generation, and targeted market segment.

• Seria
  AMD Ryzen Embedded V AMD EPYC
• Grupa CPU
  AMD Ryzen Embedded V3000 AMD EPYC 9004
• Segment
  Desktop / Server Desktop / Server
• Pokolenie
  3 4
• Model z przeszłości
  AMD Ryzen Embedded V2516 --

Essential parameters including the number of cores, threads, base and turbo frequencies, and cache size. These metrics provide insight into the processor’s speed—higher values generally indicate better performance.

• CPU Cores / Threads
  6 / 12 64 / 128
• Architektura podstawowa
  normal normal
• Rdzenie
  6x Zen 3 64x Zen 4
• Hyperthreading / SMT
  Tak Tak
• Overclocking
  Nie Nie
• Częstotliwość
  2.00 GHz 3.10 GHz
• Turbo Frequency (1 Core)
  3.80 GHz 3.75 GHz

The integrated graphics (iGPU) do not influence the CPU performance significantly; they serve as a substitute for a dedicated graphics card in the absence of one or are utilized in mobile devices.

• Nazwa procesora graficznego
  brak iGPU brak iGPU
• GPU (Turbo)
  No turbo No turbo

This section details the built-in codecs used for encoding and decoding media content, which significantly enhance processing speed and efficiency.

• h265 / HEVC (8 bit)
  Nie Nie
• h265 / HEVC (10 bit)
  Nie Nie
• h264
  Nie Nie
• VP8
  Nie Nie
• VP9
  Nie Nie
• AV1
  Nie Nie
• AVC
  Nie Nie
• VC-1
  Nie Nie
• JPEG
  Nie Nie

Overview of the types and quantities of RAM supported by AMD EPYC 9554 oraz AMD Ryzen Embedded V3C16. The supported memory frequencies may vary depending on the motherboard configuration.

• Typ pamięci
  DDR5-4800 DDR5-4800
• Max. Pamięć
  64 GB 6144 GB
• Kanały pamięci
  2 (Dual Channel) 12
• Bandwidth
  76.8 GB/s 461.0 GB/s
• ECC
  Tak Tak
• PCIe
  4.0 x 20 5.0 x 128
• AES-NI
  Tak Tak

Analyze the TDP (Thermal Design Power) requirements of AMD Ryzen Embedded V3C16 oraz AMD EPYC 9554 to make an informed decision on the appropriate cooling system. Remember that TDP refers to thermal watts, not electrical watts.

• TDP (PL1)
  15 W 360 W
• TDP up
  25 W 400 W
• TDP down
  10 W 320 W
• Temperatura maksymalna
  105 °C 100 °C

Information on architecture, interfaces, and additional instructions supported by AMD Ryzen Embedded V3C16 oraz AMD EPYC 9554, including virtual machine technologies and fabrication processes.

• Proces technologiczny
  6 nm 5 nm
• Chip design
  Chiplet Chiplet
• Gniazdo
  FP7r2 SP5
• L2-Cache
  3.00 MB 64.00 MB
• L3-Cache
  16.00 MB 256.00 MB
• Architektura
  Rembrandt (Zen 3+) Genoa (Zen 4)
• Operating systems
  Windows 10, Windows 11, Linux Windows Server 2022, Linux, Windows 11
• Wirtualizacja
  AMD-V, SVM AMD-V, SVM
• Zestaw instrukcji (ISA)
  x86-64 (64 bit) x86-64 (64 bit)
• Rozszerzenia ISA
  SSE4a, SSE4.1, SSE4.2, AVX2, FMA3 SSE4.2, AVX2, AVX-512, BFLOAT16, VNNI
• Data wydania
  Q3/2022 Q4/2022
• Release price
  -- 9087 $
• Part Number
  -- 100-000000790
• specyfikacja
  Technical data sheet Technical data sheet